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Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate

A technology of vapor chamber and cover plate, which is applied in the field of heat dissipation. It can solve the problems of poor bonding force between capillary structure and cover plate, capillary performance cannot be kept stable, and complicated sintering process, so as to broaden the application range, improve strength, and simple process. Effect

Active Publication Date: 2022-01-07
AAC TECH NANJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the manufacturing methods of the capillary structure of the chamber cover plate in the industry mainly include copper powder sintering and copper mesh bonding. The sintering process is complicated, the efficiency is low, and the price is high. The capillary structure of the capillary structure has poor bonding force with the cover plate, so that the capillary performance cannot be kept stable, the yield is not high, and it is difficult to produce on a large scale

Method used

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  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate
  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate
  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate

Examples

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Effect test

Embodiment 1

[0068] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm and 0.4mm.

[0069] S2. Degreasing: The solution used is a weakly alkaline degreasing solution, the ingredients include trisodium phosphate 50g / L, sodium carbonate 20g / L, sodium metasilicate 20g / L, OP emulsifier 5ml / L, and the solution temperature is 50°C , put the upper cover plate into the solution for cathodic electrolysis for 4min, and the current density is 2A / dm 2 , and then immediately rinse with pure water.

[0070] S3. Rust removal: use a rust remover with a mixed acid solution, and its ingredients include sulfuric acid 180g / L, nitric acid 10g / L, hydrochloric acid 2g / L, urea 5g / L, and benzotriazole 0.2g / L. Soak the upper cover in the solution for 5 minutes at room temperature, and then immediately wash it with pure water.

[0071] S4. Electrochemical deposition of zinc-nickel alloy: the solution used is nickel sulfa...

Embodiment 2

[0075] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm-0.4mm.

[0076] S2. Degreasing: The solution used is a weak alkaline degreasing solution, the ingredients include trisodium phosphate 40g / L, sodium carbonate 20g / L, sodium metasilicate 20g / L, OP emulsifier 2ml / L, and the solution temperature is 60°C , Put the upper cover plate into the solution for cathodic electrolysis for 5min, the current density is 3A / dm 2 , and then immediately rinse with pure water.

[0077] S3. Rust removal: use a rust remover with a mixed acid solution, and its ingredients include sulfuric acid 200g / L, nitric acid 8g / L, hydrochloric acid 5g / L, urea 10g / L, and benzotriazole 0.5g / L. Soak the upper cover in the solution for 3 minutes at room temperature, and then immediately wash it with pure water.

[0078] S4. Electrochemical deposition of zinc-nickel alloy: the solution used is nickel sulfate 120g / L,...

Embodiment 3

[0082] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm-0.4mm.

[0083] S2. Degreasing: The solution used is a weak alkaline degreasing solution, the ingredients include trisodium phosphate 50g / L, sodium carbonate 20g / L, sodium metasilicate 20g / L, OP emulsifier 3ml / L, and the solution temperature is 55°C , Put the upper cover plate into the solution for cathodic electrolysis for 5min, the current density is 2A / dm 2 , and then immediately rinse with pure water.

[0084]S3. Pickling: Use a rust remover with a mixed acid solution. The ingredients include 220g / L sulfuric acid, 10g / L nitric acid, 5g / L hydrochloric acid, 10g / L urea, and 0.6g / L benzotriazole. Soak the upper cover in the solution for 3 minutes at room temperature, and then immediately wash it with pure water.

[0085] S4. Electrochemical deposition of zinc-nickel alloy: the solution used is nickel sulfate 110g / L, zinc su...

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Abstract

The invention provides a method for preparing a cover plate on a temperature chamber, a cover plate on a temperature chamber, and a temperature chamber. The method for preparing the cover plate on a temperature chamber includes the following processes: making the upper cover plate of the temperature chamber; Electrochemical deposition is carried out on the upper cover plate, and a capillary structure layer with a porous structure is deposited on the inner wall of the upper cover plate. The electrolyte includes nickel sulfate of 60g / L-120g / L, zinc sulfate of 60g / L-120g / L, ammonium chloride of 40g / L-100g / L and a second additive of 0.7g / L-3.7g / L , the pH value of the electrolyte is 2-5; the capillary structure layer is heat-treated to obtain a uniform temperature plate cover plate with a capillary structure layer. The invention has the advantages of convenient operation, simple process, low cost, easy-to-control thickness of the constructed capillary structure, good performance, close combination with the cover plate, can be used for making ultra-thin uniform temperature plates, and solves most of the process defects of the traditional method.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a method for preparing a cover plate on a uniform temperature plate and a uniform temperature plate. 【Background technique】 [0002] At present, the manufacturing methods of the capillary structure of the chamber cover plate in the industry mainly include copper powder sintering and copper mesh bonding. The sintering process is complicated, the efficiency is low, and the price is high. The bonding force between the capillary structure and the cover plate is poor, so that the capillary performance cannot be kept stable, the yield is not high, and it is difficult to mass-produce. Therefore, it is urgent to develop a capillary structure manufacturing method with simple process, low cost, close combination with the cover plate, stable and efficient performance. 【Content of invention】 [0003] One of the objectives of the present invention is to provide a method for prep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56C25D5/50C25D5/48C25D5/34F28D15/04
CPCC25D3/562C25D3/565C25D5/50C25D5/48C25D5/34F28D15/046
Inventor 陈晓杰石一卉方文兵
Owner AAC TECH NANJING
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