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Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate

A technology of vapor chamber and cover plate, applied in the field of heat dissipation, which can solve problems such as poor bonding force between capillary structure and cover plate, capillary performance cannot be kept stable, complicated sintering process, etc., and achieves the advantages of widening the scope of use, improving strength and simple process Effect

Active Publication Date: 2022-03-01
AAC TECH NANJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the manufacturing methods of the capillary structure of the chamber cover plate in the industry mainly include copper powder sintering and copper mesh bonding. The sintering process is complicated, the efficiency is low, and the price is high. The capillary structure of the capillary structure has poor bonding force with the cover plate, so that the capillary performance cannot be kept stable, the yield is not high, and it is difficult to produce on a large scale

Method used

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  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate
  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate
  • Preparation method of a cover plate on a uniform temperature plate and a uniform temperature plate

Examples

Experimental program
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Effect test

Embodiment 1

[0066] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm-0.4mm.

[0067] S2. Degreasing: The solution used is a weakly alkaline degreasing solution, the ingredients include trisodium phosphate 50g / L, sodium carbonate 20g / L, sodium metasilicate 20g / L, OP emulsifier 3ml / L, and the solution temperature is 50°C , Put the upper cover plate into the solution for cathodic electrolysis for 5min, the current density is 2A / dm 2 , and then immediately rinse with pure water.

[0068] S3. Rust removal: use a rust remover with a mixed acid solution, and its ingredients include sulfuric acid 200g / L, nitric acid 10g / L, hydrochloric acid 5g / L, urea 10g / L, and benzotriazole 0.5g / L. Soak the upper cover in the solution for 3 minutes at room temperature, and then immediately wash it with pure water.

[0069] S4. Electrochemical deposition of copper: using solution is the mixture of copper sulfate 80g...

Embodiment 2

[0073] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm-0.4mm.

[0074] S2. Degreasing: The solution used is a weakly alkaline degreasing solution, the ingredients include trisodium phosphate 20g / L, sodium carbonate 40g / L, sodium metasilicate 30g / L, OP emulsifier 3ml / L, and the solution temperature is 50°C , put the upper cover plate into the solution for cathodic electrolysis for 3 minutes, and the current density is 3A / dm 2 , and then immediately rinse with pure water.

[0075] S3. Rust removal: use a rust remover with a mixed acid solution, and its ingredients include sulfuric acid 150g / L, nitric acid 15g / L, hydrochloric acid 5g / L, urea 5g / L, and benzotriazole 0.8g / L. Soak the upper cover in the solution for 5 minutes at room temperature, and then immediately wash it with pure water.

[0076] S4. Electrochemical deposition of copper: using solution is the mixture of copper sul...

Embodiment 3

[0080] S1. Fabrication of the upper cover and the lower cover: obtained by etching the copper sheet, the thickness of the copper sheet is between 0.05mm-0.4mm.

[0081]S2. Degreasing: The solution used is a weakly alkaline degreasing solution, the ingredients include 40g / L trisodium phosphate, 30g / L sodium carbonate, 10g / L sodium metasilicate, 1ml / L OP emulsifier, and the solution temperature is 60°C , Put the upper cover plate into the solution for cathodic electrolysis for 2min, the current density is 5A / dm 2 , and then immediately rinse with pure water.

[0082] S3. Rust removal: Use a rust remover with a mixed acid solution, and its ingredients include sulfuric acid 250g / L, nitric acid 5g / L, hydrochloric acid 10g / L, urea 10g / L, and benzotriazole 1g / L. Soak the upper cover in the solution for 2 minutes at room temperature, and then immediately wash it with pure water.

[0083] S4. Electrochemical deposition of copper: using solution is the mixture of copper sulfate 30g / L,...

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Abstract

The invention provides a method for preparing a cover plate on a temperature chamber, a cover plate on a temperature chamber, and a temperature chamber. The method for preparing the cover plate on a temperature chamber includes the following processes: making the upper cover plate of the temperature chamber; Electrochemical deposition is carried out on the upper cover plate, and a capillary structure layer with a porous structure is deposited on the inner wall of the upper cover plate, wherein the upper cover plate is used as the cathode of electrochemical deposition; Including 30g / L-80g / L copper sulfate, 150g / L-200g / L sulfuric acid, sulfate with a sulfate concentration of 0.04mol / L-0.55mol / L and 11.5mL / L-46.5mL / L An additive; heat-treating the capillary structure layer to obtain a uniform temperature plate and cover plate with the capillary structure layer. The present invention builds a capillary structure on the inner side of the vapor chamber by the method of electrochemical deposition. The method is convenient to operate, simple in process, low in cost, easy to control in thickness, good in performance, and closely combined with the cover plate, and can be used to make super Thin vapor chamber solves most of the process defects of traditional methods.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a method for preparing a cover plate on a uniform temperature plate, and a uniform temperature plate. 【Background technique】 [0002] At present, the manufacturing methods of the capillary structure of the chamber cover plate in the industry mainly include copper powder sintering and copper mesh bonding. The sintering process is complicated, the efficiency is low, and the price is high. The bonding force between the capillary structure and the cover plate is poor, so that the capillary performance cannot be kept stable, the yield is not high, and it is difficult to mass-produce. Therefore, it is urgent to develop a capillary structure manufacturing method with simple process, low cost, close combination with the cover plate, stable and efficient performance. 【Content of invention】 [0003] One of the objectives of the present invention is to provide a method for pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D5/00
CPCC25D3/38C25D5/00
Inventor 陈晓杰石一卉方文兵
Owner AAC TECH NANJING
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