Micro-fluidic chip welding method
A technology of microfluidic chips and welding methods, applied in welding equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of reducing the height of transparent glass media, affecting materials, heating, etc.
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no. 1 example
[0035] see Figure 1-Figure 7 , a microfluidic chip welding method, comprising a welding fixture 1, a laser welding head 2, a motion platform 3 for controlling the movement of the laser welding head 2, a microfluidic chip 4 and a light-transmitting plate 5 respectively placed on the welding fixture 1, Its welding method comprises the following steps:
[0036] a. Coat a layer of light-shielding material 6 on the light-shielding material 6, and perform laser marking on the light-shielding plate 5 coated with the light-shielding material 6. During the laser marking, according to the channel path L1 of the microfluidic chip 4, the Part of the light-shielding substance 6 is removed to form a light-transmitting path L2 consistent with the flow path L1 on the light-transmitting plate 5;
[0037] b. The microfluidic chip 4 is covered with a thin film 7, and the microfluidic chip 4 covered with the thin film 7 and the light-transmitting plate 5 are respectively clamped on the welding ...
no. 2 example
[0059] A microfluidic chip welding method is different from the first embodiment in that: laser welding uses a semiconductor laser with a laser wavelength of 900-1000nm to achieve welding of a transparent film and an opaque substrate.
[0060] Other parts not described are the same as those of the first embodiment, and will not be described in detail here.
no. 3 example
[0062] A microfluidic chip welding method is different from the first embodiment in that laser welding uses a semiconductor laser with a laser wavelength of 1700-2000nm to achieve welding of transparent films and transparent substrates without adding light absorbing agents.
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