Optimization method of system-in-package structure

Abstract

The invention discloses an optimization method of a system-in-package SIP (Session Initiation Protocol) structure, which mainly overcomes the defects of complex operation and high cost of the existingSIP structure optimization technology, and adopts the scheme that an initial finite element model is established, and the maximum stress value A and the safety margin S of the initial finite elementmodel in a vibration state are calculated; factors influencing the stress of the SIP structure are selected; parameterizing the selected factor, and calculating the sensitivity of the factor to the SIP structure stress; selecting a high-sensitivity factor as a key factor; selecting key factor parameters to establish an orthogonal test table; according to the test table, establishing a corresponding finite element model for testing and processing to obtain a factor combination; calculating the maximum stress value and the safety margin S'under the factor combination; comparing S with S 'to obtain an optimal factor combination; and designing an SIP structure according to the optimal factor combination parameters. According to the method, the reliability of the SIP is improved in the design level, the operation complexity is reduced, the cost is reduced, and the method can be used for the structural design of system-in-package.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to an optimization method of a system-level packaging structure, which can be used in the structural design of a system-level packaging SIP. Background technique [0002] Today's microelectronic packaging technology is constantly improving, making the market's requirements for packaging higher and higher. Thin and short, multi-functional, low power consumption, and fast speed are the development trends of today's electronic products. The new system-in-package SIP technology continues Moore's Law at the system level, and semiconductor companies in the industry are paying more and more attention to and developing SIP. [0003] The existing SIP technology is to assemble multiple active components and passive components with different functions, multi-chip components MEMS, optical devices and other devices into a single standard package that can provide multiple fun...

AI Technical Summary

Problems solved by technology

[0004] In recent years, research on SIP defect diagnosis and failure analysis technology has been mainly carried out at home and abroad. However, due to the complexity of SIP, higher requirements are placed on design and process technology, and its reliability is the industry's concern. Focus, and the main purpose of optimizing the SIP structure is to improve its reliability. The existing SIP reliability research mainly includes failure analysis, reliability test, process control, reliability design, etc.; but these are improved through failure analysis and process control. The reliability method has high requirements for equipment and process, so there are defects of complicated operation and high cost

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