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Low-temperature cover plate ink and preparation method thereof

A technology of ink and cover plate, applied in the field of low temperature cover plate ink and its preparation, can solve the problems of low dyne value and high temperature of curing and film formation of cover plate ink, and achieve the advantages of improving volatilization speed, increasing roughness and increasing contact area. Effect

Active Publication Date: 2021-01-29
厦门三德信科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a low-temperature cover ink and its preparation method, which solves the problems of high curing film-forming temperature and low dyne value of the existing cover ink

Method used

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  • Low-temperature cover plate ink and preparation method thereof
  • Low-temperature cover plate ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] In the low-temperature cover plate ink of the present embodiment, the first component comprises the following components (in mass percentage):

[0050] components Specification percentage content High molecular weight saturated polyester resin Molecular weight 10000-30000 20.5％ Small molecular weight hydroxyl saturated polyester resin Molecular weight 2000-7000 20％ carbon black powder 13％ Isophorone —— 16％ Ethylene glycol butyl ether —— 10％ Silica for matting powder 8％ SiO2 for thickening powder 2％ SDBS —— 7.5％ cellulose acetate —— 0.5％ BYK-066N Commercial specification 0.5％ A silane coupling agent Commercial KH560 2％

[0051] The preparation steps of the first component are as follows:

[0052] (1) Put the carbon black into a high-speed stirred tank at 80°C, the stirring speed is 400rpm, and the stirring time is 10h.

[0053] (2) Add isophorone, ethylene glycol butyl et...

Embodiment 2

[0067] In the low-temperature cover plate ink of the present embodiment, the first component comprises the following components (in mass percentage):

[0068]

[0069]

[0070] The first component is prepared according to the method of Example 1, and the first component is mixed with 8% isocyanate curing agent (BASF Lupranate M 20S), and is respectively applied to the surface of the PET base plate and the surface of the CPI base plate (preliminary Remove oil and dust), bake at 60±5°C for 60 minutes, the ink is completely dry and cured into a paint film.

[0071] The PET / CPI substrate plate of embodiment 2 is carried out hundred grid test (dyne value adopts dyne pen to test), and the result is as follows:

[0072] Adhesion boiled Dyne value Bending properties Substrate 5B 5B 34 200,000 times, no change in appearance PET, CPI

[0073] Note: The boil test is boiled at 80°C for 30 minutes.

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Abstract

The invention relates to low-temperature cover plate ink which comprises a first component, wherein the first component is prepared from the following components in percentage by mass: 20-30 percent of large-molecular-weight saturated polyester resin, 20-30 percent of small-molecular-weight hydroxyl saturated polyester resin, 10-20 percent of carbon black, 15-25 percent of isophorone, 10-20 percent of glycol ether, 1-3 percent of silicon dioxide for thickening, 5-15 percent of silicon dioxide for extinction, 5-10 percent of dispersing agent, 0.1-1 percent of leveling agent, 0.1-1 percent of defoamer and 1-3 percent of silane coupling agent. Before the ink is used, an isocyanate curing agent is added according to the amount of 5-10% of the first component, and the mixture is uniformly stirred and then coated or printed on the surface of a base material. Experiments prove that the ink of the formula can be completely cured on a PET or CPI base material after being baked at 55-75 DEG C for 60 minutes, and after curing, the adhesive force of the ink is 5B grade, the boiling performance is 5B, the dyne value reaches 32-34, the bending performance is 200,000 times, and the appearance isnot changed in a hundred-grid test.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to low-temperature cover plate inks and a preparation method thereof. Background technique [0002] Touch screen mobile phones are currently the most popular form of mobile phones. In the industry, in order to make the color of the mobile phone cover and the body match, black frame / white frame of ink will be printed on the cover, which is not only beautiful but also prevents light leakage from the screen. Otherwise, if there is no ink frame, the edge of the screen will be You will see obvious halos, which will affect the user's use. At present, the printing method of the ink is to apply the ink to the cover plate, and then bake it at high temperature to make it dry and solidify to form a film. At present, due to the reason of the formula, the ink has a high curing film forming temperature and a low dyne value [high dyne value has low surface tension and low surface energy, and it is ...

Claims

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Application Information

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IPC IPC(8): C09D11/104C09D11/03
CPCC09D11/104C09D11/03
Inventor 欧阳文庄江强
Owner 厦门三德信科技股份有限公司
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