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Surface-mounted fuse based on low-temperature co-fired ceramic technology and preparation method thereof

A technology of low-temperature co-fired ceramics and surface mounting, which is applied in the manufacture of fuses, emergency protection devices, emergency protection devices, etc. It can solve problems such as diffusion surfaces and unevenness, achieve good wettability, prevent penetration, and meet performance requirements Effect

Active Publication Date: 2021-01-26
SEMITEL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, the object of the present invention is to provide a surface mount fuse based on low temperature co-fired ceramic technology and its preparation method. And the problem of surface unevenness makes the graphic of the fuse more complete, clear and controllable; the fusing process of the prepared surface mount fuse is fast, and there will be no phenomenon of arcing

Method used

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  • Surface-mounted fuse based on low-temperature co-fired ceramic technology and preparation method thereof
  • Surface-mounted fuse based on low-temperature co-fired ceramic technology and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A method for preparing a surface-mount fuse based on low-temperature co-fired ceramic technology in Example 1 includes the following steps:

[0051] Step 1, preparing low temperature co-fired ceramic powder

[0052] Weigh 30 parts of calcium oxide powder, 25 parts of boron oxide powder, and 35 parts of silicon oxide powder, put them into a 500ml ball mill jar made of zirconia, and perform ball milling. The ball-to-material ratio is 4:1, and the dry powder ball mills for 4 hours , after cooling, ultrasonically pass through an 80-mesh sieve to separate and obtain mixed powder;

[0053] Take a 250ml platinum crucible and preheat it in a high-temperature furnace at 1250°C for 30 minutes, then place the mixed powder in the platinum crucible, and heat the mixed powder in a high-temperature furnace at 1250°C for 30 minutes. When it is completely melted, take out the platinum crucible to obtain the molten material, and place the molten material in deionized water for water que...

Embodiment 2

[0086] The preparation method of the surface mount fuse of this embodiment 2 is the same as that of embodiment 1, and its difference from embodiment 1 is:

[0087] The mixed powder in step 1 of Example 2 includes 35 parts of calcium oxide powder, 30 parts of boron oxide powder, and 40 parts of silicon oxide powder; in step 1, when preparing low-temperature co-fired ceramic powder, two low-temperature co-fired The ceramic powders are respectively, one is: it contains 85 parts of Ca-B-Si series glass-ceramic powder and 13 parts of zirconia powder, which is used for the heat insulation layer; the other is: it contains Ca-B-Si series 85 parts of glass-ceramic powder and 16 parts of zirconia powder are used for the arc-extinguishing layer; the solid content in the low-temperature co-fired ceramic slurry for the heat-insulation layer is 76%, and the arc-extinguishing layer uses the low-temperature co-fired ceramic slurry The solids content was 68%.

[0088] The fuse electrode paste...

Embodiment 3

[0092] The preparation method of the surface mount fuse of this embodiment 3 is the same as that of embodiment 1, and its difference from embodiment 1 is:

[0093] The mixed powder in step 1 of Example 3 includes 40 parts of calcium oxide powder, 35 parts of boron oxide powder, and 45 parts of silicon oxide powder; in step 1, when preparing low-temperature co-fired ceramic powder, two kinds of low-temperature co-fired The ceramic powders are respectively, one is: it contains 90 parts of Ca-B-Si series glass-ceramic powder and 15 parts of zirconia powder, which is used for the heat insulation layer; the other is: it contains Ca-B-Si series 90 parts of glass-ceramic powder and 20 parts of zirconia powder are used for the arc-extinguishing layer; the solid content in the low-temperature co-fired ceramic slurry for the heat-insulating layer is 80%, and the arc-extinguishing layer uses 80% of the solid content in the low-temperature co-fired ceramic slurry The solid content is 70%....

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Abstract

The invention discloses a surface-mounted fuse based on a low-temperature co-fired ceramic technology and a preparation method thereof. The preparation method comprises the following steps of sequentially preparing low-temperature co-fired ceramic powder, an organic carrier, low-temperature co-fired ceramic slurry, fuse electrode slurry, terminal electrode slurry, a positive electrode layer and aback electrode layer, then sequentially printing the low-temperature co-fired ceramic slurry, the fuse electrode slurry and the terminal electrode slurry on a ceramic substrate, and then co-firing each printing slurry layer to obtain a surface-mounted fuse semi-finished product, then, manufacturing a glass protection layer and identification characters on the surface-mounted fuse semi-finished product, and finally, acquiring a surface-mounted fuse finished product through a post-processing procedure. According to the preparation method, a low-temperature co-fired ceramic technology is utilized, so that the problems of diffusion and uneven surface during printing of the fuse electrode slurry are solved, and the pattern of the fuse is more complete, clearer and higher in controllability; thefusing process of the prepared surface-mounted fuse is rapid, and the phenomenon of arc discharge is avoided.

Description

technical field [0001] The invention relates to the technical field of surface mount fuses, in particular to a surface mount fuse based on low temperature co-fired ceramic technology and a preparation method thereof. Background technique [0002] Surface mount fuses are mainly used in the overcurrent protection of printed circuit boards and other circuits. The principle is that when the circuit fails or is abnormal, the metal melt of the fuse itself fuses and cuts off the current to protect the circuit. The surroundings of the metal melt are tightly surrounded by the polymer material or ceramic material of the matrix part. Even the molten metal cannot shrink to both ends, and can only rely on the diffusion and penetration of the surrounding materials or be absorbed by the surrounding materials. Absorption, if the overcurrent disappears during this process (such as instantaneous pulse phenomenon) or the heat generated is quickly dissipated by the substrate, and the process of...

Claims

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Application Information

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IPC IPC(8): C04B41/90H01B1/02H01H69/02H01H85/38H01H85/47
CPCC04B41/90C04B41/52H01H69/022H01H85/47H01H85/38H01B1/02C04B41/5116C04B41/483C04B41/5022C04B41/472C04B41/463C04B41/5023C04B41/51C04B41/5035C04B41/47C04B41/5042C04B41/5025
Inventor 董福兴戴剑仇利民龚建袁生红
Owner SEMITEL ELECTRONICS
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