Bi-component high-temperature-resistant and low-temperature-resistant novel acrylate structural adhesive and preparation method thereof
An acrylate and acrylate-based technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., to achieve the effects of short heating and curing time, good stability, and excellent process performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
specific Embodiment approach 1
[0028] Specific embodiment 1: This embodiment provides a two-component high-temperature-resistant novel acrylic structural adhesive, including component A and component B; the volume ratio of component A and component B is (5- 15): 1; wherein, component A is prepared from the following raw materials in weight ratio: 30-60 parts of acrylic monomer a, 5-30 parts of polyimide oligomer, 5-20 parts 1-5 parts of toughening agent, 1-5 parts of stabilizer, 0.5-5 parts of coupling agent, 0.5-5 parts of accelerator, 0.5-5 parts of other auxiliary agents; the B component is formulated by the following weight It is prepared from the following raw materials: 10-40 parts of acrylate monomer b, 10-50 parts of plasticizer, 3-10 parts of oxidizing agent and 0.1-0.5 parts of polymerization inhibitor.
[0029] In this embodiment, methyl methacrylate can be selected as the acrylate monomer; methyl methacrylate is the main active monomer of acrylic structural adhesives, and at the same time, highe...
specific Embodiment approach 2
[0039] Embodiment 2: The difference between this embodiment and Embodiment 1 is that: the volume ratio of the A component and the B component is (9-11):1, and the others are the same as the Embodiment 1.
specific Embodiment approach 3
[0040] Specific embodiment 3: The difference between this embodiment and specific embodiments 1 and 2 is that the volume ratio of the A component and B component is 10:1, and the others are the same as the specific embodiments 1 and 2.
PUM
Property | Measurement | Unit |
---|---|---|
thermal resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com