Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-temperature-resistant epoxy glue film and preparation method thereof

An epoxy adhesive film, high temperature resistant technology, used in epoxy resin adhesives, adhesives, polymer adhesive additives, etc., can solve problems such as unfavorable assembly, affecting production efficiency, energy consumption, shedding, etc. The molding time, the preparation process are simple and easy, and the heating and curing time is short.

Inactive Publication Date: 2019-06-07
DOCBOND TECH DEV CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The normal temperature film-forming property of the existing epoxy film has too fast curing time, which is not conducive to the later factory assembly;
[0004] 2. The heating and curing speed of the existing epoxy film is slow after film formation. Generally, it needs to be baked at 120°C for 30 minutes to cure, which affects production efficiency and consumes a lot of energy;
[0005] 3. The existing epoxy film is not good at high temperature resistance, and it will cause deformation and shedding after long-term temperature resistance. Therefore, further improvement is needed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-temperature-resistant epoxy glue film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The present embodiment provides a high temperature resistant epoxy adhesive film, which is composed of the following percentages of raw materials:

[0031] 62 parts of resin,

[0032] 7 parts of toughening agent,

[0033] 20 parts of curing agent,

[0034] 35 parts of solvent.

[0035] In this embodiment, the resins are 43 parts of solid bisphenol A resin and 9 parts of liquid phenolic resin.

[0036] In this embodiment, the solvent is ethyl acetate.

[0037] In this embodiment, the toughening agent is 7 parts of liquid nitrile rubber.

[0038] In this embodiment, the curing agent is modified imidazoles: aromatic amine curing agent in a ratio of 5:15 to mix 20 parts of the curing agent.

[0039] A preparation method of a high temperature resistant epoxy adhesive film, comprising the following steps:

[0040] 1) Weigh the raw materials of each component in proportion;

[0041] 2) under the condition that the rotating speed of the mixer is 500r / min, the resin is di...

Embodiment 2

[0044] The present embodiment provides a high temperature resistant epoxy adhesive film, which is composed of the following percentages of raw materials:

[0045] 100 parts of resin,

[0046] 7 parts of toughening agent,

[0047] 20 parts of curing agent,

[0048] 30 parts of solvent.

[0049] In this embodiment, the resins are 45 parts of solid bisphenol A resin and 55 parts of liquid phenolic resin.

[0050] In this embodiment, the solvent is ethyl acetate.

[0051] In this embodiment, the toughening agent is 7 parts of liquid nitrile rubber.

[0052] In this embodiment, the curing agent is modified imidazoles: aromatic amine curing agent in a ratio of 5:15 to mix 20 parts of the curing agent.

[0053] A preparation method of a high temperature resistant epoxy adhesive film, comprising the following steps:

[0054] 1) Weigh the raw materials of each component in proportion;

[0055] 2) under the condition that the rotating speed of the mixer is 500r / min, the resin is ...

Embodiment 3

[0058] The present embodiment provides a high temperature resistant epoxy adhesive film, which is composed of the following percentages of raw materials:

[0059] 20 parts of resin,

[0060] 7 parts of toughening agent,

[0061] 20 parts of curing agent,

[0062] 35 parts of solvent.

[0063] In this embodiment, the resins are 10 parts of solid bisphenol A resin and 10 parts of liquid phenolic resin.

[0064] In this embodiment, the solvent is ethyl acetate.

[0065] In this embodiment, the toughening agent is 7 parts of liquid nitrile rubber.

[0066] In this embodiment, the curing agent is modified imidazoles: aromatic amine curing agent in a ratio of 5:15 to mix 20 parts of the curing agent.

[0067] A preparation method of a high temperature resistant epoxy adhesive film, comprising the following steps:

[0068] 1) Weigh the raw materials of each component in proportion;

[0069] 2) under the condition that the rotating speed of the mixer is 500r / min, the resin is d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a high-temperature-resistant epoxy glue film. The epoxy glue film is composed of the following components: 20-100 parts of resin, 2-35 parts of a toughening agent, 2-30 parts ofa curing agent and 10-100 parts of a solvent; and a preparation method of the epoxy glue film comprises the following steps: 1) weighing the raw materials according to a ratio; 2) dispersing the resin into a solvent to obtain a resin dispersion liquid under the condition of a rotation speed of a stirring machine of 100-1000 r / min; and 3) dispersing the toughening agent and the curing agent into the resin dispersion liquid obtained in the step (2), and performing stirring for 0.5-6 h to obtain the high-temperature-resistant hot-press molded epoxy glue. The epoxy glue provided by the inventioncan be baked at 200 DEG C for a long time without occurrence of brittle deformation after being cured, and has extremely-strong stability.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a high temperature resistant epoxy adhesive film and a preparation method thereof. Background technique [0002] Epoxy resin film generally refers to an adhesive made of epoxy resin as the main body. Due to its high bonding strength, simple operation process and good film-forming properties, it is widely used on films such as PU. But the existing epoxy film has the following shortcomings: [0003] 1. The room temperature film-forming curing time of the existing epoxy adhesive film is too fast, which is not conducive to the later factory assembly; [0004] 2. The existing epoxy adhesive film has a slow heating and curing speed after film formation. Generally, it takes 30 minutes to cure at 120 ° C, which affects production efficiency and high energy consumption; [0005] 3. The high temperature resistance effect of the existing epoxy adhesive film is not good, and i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J109/02C09J11/06C09J11/08
Inventor 郑健保李锦青莫华
Owner DOCBOND TECH DEV CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com