A kind of deep ultraviolet light emitting diode based on electronic buffer and its manufacturing method
A technology of light-emitting diodes and electronic buffering, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of limited radiation recombination in the active area, hinder injection into the active area, and reduce the height of the valence band, so as to improve luminous efficiency and improve Radiative recombination rate, effect of slowing thermal transition speed
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no. 1 example
[0025] see figure 1 , an embodiment of the present invention is a deep ultraviolet light-emitting diode based on an electronic buffer. The deep ultraviolet light-emitting diode includes a substrate, a buffer layer that is epitaxially grown on the substrate, an n-type semiconductor layer, an electronic buffer, and an organic light-emitting diode. source layer, p-type semiconductor layer and contact layer, wherein the electron buffer is non-doped B x Al 1-x N-layer and n-type Al y Ga 1-y A multi-period composite structure in which N layers are alternately grown, and the last grown non-doped B in the multi-period composite structure x Al 1-x The N layer is in contact with the first barrier layer in the active layer.
[0026] In an embodiment of the present invention, the value range of x is: 0.01≤x≤0.3, and the value range of y is: 0.01≤y≤1.
[0027] In an embodiment of the present invention, each B in the electronic buffer x Al 1-x N layer and the B x Al 1-x Al on the ...
no. 2 example
[0034] see figure 2 , an embodiment of the present invention provides a method for manufacturing a deep ultraviolet light-emitting diode based on an electronic buffer. The method includes: providing a substrate; growing a buffer layer and an n-type semiconductor layer sequentially on the substrate using MOCVD equipment. Layer, electron buffer, active layer, p-type semiconductor layer and contact layer; Wherein, described electron buffer is B x Al 1-x N-layer and n-type Al y Ga 1-y A multi-period composite structure in which N layers are alternately grown, and the last grown non-doped B in the multi-period composite structure x Al 1-x The N layer is in contact with the first barrier layer in the active layer.
[0035] In a certain embodiment of the present invention, the manufacturing method is specifically:
[0036] S101. Provide a substrate;
[0037] S102, sequentially depositing a buffer layer and an n-type semiconductor on the substrate;
[0038] S103, depositing n...
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