Preparation method of epoxy resin and organic silicon composite pouring sealant

Abstract

The invention discloses a preparation method of an epoxy resin and organic silicon composite pouring sealant. The preparation method comprises the following steps: (1) preparing a component A, namelyvacuumizing and stirring epoxy resin, aluminum oxide coated graphene, an epoxy siloxane coupling agent and dibenzyl phosphate in a high-speed dispersion machine at normal temperature for 70-90 minutesat the rotating speed of 1000-1200rpm and the vacuum degree of 0.15-0.25 MPa to prepare the component A; and (2) preparing a component B, namely adding amino silicone oil, an amino silane coupling agent and aluminum oxide coated graphene into a high-speed dispersion machine at room temperature, vacuumizing and stirring for 30-50 minutes at room temperature under the vacuum degree of 0.1-0.2 MPa and the rotating speed of 800-1000 rpm to prepare the component B; the epoxy resin and organic silicon composite pouring sealant prepared by the invention overcomes the defects of the traditional pouring sealant, has excellent mechanical properties, insulation, sealing, waterproofness, thermal conductivity, flame retardancy, chemical stability and adhesive property, and is simple and feasible in pouring operation.

Description

[0001] This invention is a divisional application of the Chinese patent "An Epoxy Resin-Organosilicon Composite Potting Adhesive and Its Preparation Method". The application date is November 12, 2017, and the application number is 201711110510.4. technical field [0002] The invention relates to the technical field of potting glue, in particular to an epoxy resin and silicone composite potting glue and a preparation method thereof. Background technique [0003] With the development of economy and society, electronic materials and electronic products have sprung up like mushrooms. In order to cooperate with the development of electronic materials and electronic products, people have proposed new methods for the potting adhesive used for bonding, potting and packaging of electronic components. Requirements, not only require it to have excellent mechanical properties, perfect appearance, insulation, sealing, waterproof, but also require it to have good thermal conductivity, flam...

AI Technical Summary

Problems solved by technology

[0004] At present, there are three main types of potting materials that are widely used, which are epoxy resin, polyurethane and silicone materials. Room temperature curing epoxy resin potting adhesives are widely used in electronic components due to their good mechanical properties and adhesion. However, unmodified epoxy resin has high rigidity, poor toughness under high and low temperature impact, easy cracking of the adhesive layer, and poor dimensional stability caused by thermal expansion and contraction under high and low temperature; silicone materials It has excellent high and low temperature resistance, weather resistance and electrical insulation, but it has the defects of low thermal conductivity, poor flame retardancy and poor bonding performance; polyurethane materials have the best waterproof, acid resistance, flexibility and impact resistance. It is better, but when it is used as an electronic packaging glue, there are more air bubbles, and it needs to be vacuumed and filled, and the operation is more complicated