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In-situ nano-copper paste and preparation process and application thereof

A preparation process, nano-copper technology, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., to achieve long-term stable storage, good dispersion, and avoid agglomeration problems.

Active Publication Date: 2020-11-10
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above improvements did not fundamentally solve the problem of agglomeration and oxidation of nano-copper particles.

Method used

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  • In-situ nano-copper paste and preparation process and application thereof

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Experimental program
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Effect test

Embodiment 1

[0045] This embodiment provides an in-situ nano-copper paste, and using the in-situ nano-copper paste for sintering interconnection, such as figure 1 As shown, the preparation process is as follows:

[0046] S1. Preparation of nano-copper solution

[0047] Under the condition of 50°C, copper acetate and ascorbic acid were put into 500mL ethylene glycol solvent for reaction according to the molar ratio of 1:6, and the nano-copper solution was obtained after reaction for 20 minutes;

[0048] S2. Preparation of in-situ nano copper paste

[0049] Pour the nano-copper solution obtained in S1. into a centrifuge tube, centrifuge in a centrifuge for 5 minutes under the condition of 12000r / min, and then stir to obtain a uniform mass fraction of 80% in-situ nano-copper paste, nano-copper particles The particle size is 50-100nm.

[0050] Coat the paste on the copper substrate, cover the coated copper paste with the interconnect chip, put it into a hot-press furnace, and sinter it at 300...

Embodiment 2

[0052] This embodiment provides an in-situ nano-copper paste, and using the in-situ nano-copper paste for sintering interconnection, such as figure 1 As shown, the preparation method is as follows:

[0053] S1. Preparation of nano-copper solution

[0054] Under the condition of 80°C, copper hydroxide and ascorbic acid were put into 400mL terpineol solvent for reaction according to the molar ratio of 1:10, and the nano-copper solution was obtained after reaction for 30 minutes;

[0055] S2. Preparation of in-situ nano copper paste

[0056] Pour the nano-copper solution obtained in S1 into a rotary evaporator and evaporate it for 30 minutes at a rotation speed of 120r / min, an evaporation temperature of 200°C, and a vacuum of 180Pa, take it out and stir to obtain a uniform mass fraction of 85% in situ The nano-copper paste, the particle diameter of the nano-copper particles is 50-100nm.

[0057] Coat this paste on a silicon substrate, cover the coated copper paste with an inte...

Embodiment 3

[0059] This embodiment provides an in-situ nano-copper paste, and using the in-situ nano-copper paste for sintering interconnection, such as figure 1 As shown, the preparation process is as follows:

[0060] S1. Preparation of nano-copper solution

[0061] Under the condition of 65°C, put copper acetylacetonate and glucose into 300mL ethylene glycol solvent for reaction according to the molar ratio of 2:1, and obtain nano-copper solution after 10 minutes of reaction;

[0062] S2. Preparation of in-situ nano copper paste

[0063] Filter the nano-copper solution obtained in S1. through a microfiltration membrane, take out the filtered nano-copper solution and stir to obtain an in-situ nano-copper paste with a uniform mass fraction of 78%, and the particle size of the nano-copper particles is 50-100nm .

[0064] Coat this paste on a silicon carbide substrate, cover the coated copper paste with an interconnection chip, put it into a hot-press furnace, and sinter it at 260°C and...

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Abstract

The invention provides in-situ nano-copper paste and a preparation process and application thereof. According to the preparation process of the in-situ nano-copper paste, copper salt and a reducing agent react in a solvent to obtain a nano-copper solution, the nano-copper solution is concentrated to obtain the in-situ nano-copper paste, and the obtained in-situ nano-copper paste can be directly applied to a substrate for sintering to realize in-situ interconnection. According to the in-situ nano-copper paste, nano-copper particles are good in dispersity in the solution, the original solution is directly concentrated to obtain the in-situ nano-copper paste, the oxidation problem caused by contact between the nano-copper particles and air can be avoided, the agglomeration problem caused by drying of the nano-copper particles also can be avoided, and the conventional thought is broken through; and moreover, the preparation technological process of the nano-copper paste is simplified, is convenient, rapid and efficient and benefits large-scale production.

Description

technical field [0001] The invention relates to the technical field of material engineering, in particular to an in-situ nano copper paste and its preparation process and application. Background technique [0002] Traditional electronic packaging and interconnection materials mainly use solder paste or conductive adhesive, but none of them can meet the requirements of high-power devices. Therefore, nano-metal materials with unique physical and chemical properties have become a research hotspot for packaging and interconnection materials. After low-temperature sintering, nano-metals are close to the melting point, electrical conductivity and thermal conductivity of bulk metals, which can better meet the working environment of high-temperature service. Among them, nano-copper metal paste stands out for its advantages of low cost, easy availability of materials, and low electrical mobility. [0003] At present, the preparation of nano-copper paste generally adopts a two-step m...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/00H01L21/60B82Y40/00B82Y30/00
CPCB22F9/24H01L24/80B82Y40/00B82Y30/00H01L2224/8084B22F1/0545B22F1/10
Inventor 张昱刘强崔成强
Owner GUANGDONG UNIV OF TECH
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