Preparation process of printed circuit board based on magnetic coverage technology

Abstract

The invention discloses a preparation process of a printed circuit board based on a magnetic coverage technology, and belongs to the technical field of communication equipment. According to the scheme, the outer dissolving layer in the thermal support particles is in contact with water and is gradually dissolved; the reductive iron powder in the thermal support particles can be promoted to be exposed outwards; the viscosity of the outer dissolving layer is used, the reductive iron powder is promoted to be uniformly distributed on the surface of a circuit board; reductive iron powder reacts with air to generate heat; the temperature of a thermal deformation metal layer can be promoted to rise and recover to the high-temperature phase state; and therefore, an oil film transmission hole is exposed out of the thermal deformation metal layer. The attraction effect of ferroferric oxide powder generated by the reaction on an oil film transmission hole is used; a thermal conductive plastic film and a circuit board are fully laminated, the oil film transmission holes are exposed, and under the guide action of oil guide fiber columns and magnetic insulation cladding, the solder resist ink smeared on the surface of the thermal conductive plastic film can be promoted to slowly enter the gap between the thermal conductive plastic film and the circuit board.

Description

technical field [0001] The invention relates to the technical field of communication equipment, and more specifically, relates to a preparation process of a printed circuit board based on magnetic covering technology. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] According to the number of layers, circuit boards are divided into three major categories: single-panel, double-panel, and multi-layer circuit boards. It is single panel at first, and on the mo...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, in the process of preparing the circuit board, it is necessary to paint the solder resist ink on the surface of the circuit board, but in the actual preparation process, since there are various irregular grooves on the surface of the circuit board, it is directly coated Brushing may cause uneven thickness of the solder resist ink layer on its surface, especially in areas with more grooves

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