SOI LIGBT device integrated with Zener diode
A Zener diode, integrated Zener technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems affecting device turn-on characteristics, etc.
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Embodiment 1
[0018] Such as figure 1 As shown, compared with the traditional device structure, the groove-gate SOI LIGBT with integrated Zener diode in this example has a Zener diode integrated in the P well region 4 near the N-type drift region 3 .
[0019] This example works as follows:
[0020] In the forward conduction, the emitter end blocks the slot gate and the control slot gate acts as a physical barrier, which is beneficial to increase the carrier concentration in the drift region, and at the same time, there are channels on both sides of the control slot gate and the side of the blocking slot gate close to the emitter exists, the channel density of the device can be increased to reduce the resistance of the channel region, and under the combined effect of the device V on can be significantly reduced. As the anode voltage rises, the Zener diode breaks down, so that the potential at the P-well region 4 is clamped, thereby reducing the Miller capacitance; at the same time, the bre...
Embodiment 2
[0024] Such as figure 2 Shown, in this example and embodiment 1 figure 1 The difference is that, in this example, a P-type buried layer 15 is introduced into the upper surface of the N-type drift region 3 to be in contact with the side of the P-type well region 4 . The working mechanism of the device in this embodiment differs from that in Embodiment 1 in that: the introduced P-type buried layer 15 and the N-type drift region 3 are mutually depleted to form a structure similar to a super junction (SJ). In the forward blocking state, the P-type buried layer 15 introduced in this example can deplete each other with the depleted N-type drift region 3, thereby optimizing the withstand voltage of the device. At the same time, when the device is turned off, the P-type buried layer 15 and the N-type drift region 3 extract holes and electrons from each other, which can accelerate the depletion of the device, thereby further reducing the turn-off time and the turn-off loss.
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