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Packaging adhesive for LED, use method and application thereof

A technology of encapsulation glue and hydroxyl end-capping, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., and can solve the problems of insufficient cold and heat shock performance and damp heat resistance, high temperature resistance, and UV resistance disadvantages, etc.

Active Publication Date: 2020-10-27
BEIJING KMT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the encapsulant prepared by it has insufficient cold and heat shock performance and moisture and heat resistance.
[0007] CN105153946A discloses a heat-and-humidity resistant LED adhesive material and its preparation method, but it has disadvantages in high temperature resistance, ultraviolet resistance, etc.

Method used

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  • Packaging adhesive for LED, use method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0064] The preparation method of MCY-51 (hydroxyl-terminated polyurethane prepolymer) is as follows:

[0065] 1. Vacuum dehydrate the PTMG1000 at 120°C for 2 hours;

[0066] 2. Add 548 parts by weight of PTMG-1000 and 0.5 parts by weight of dibutyltin dilaurate catalyst into the reactor, stir and mix well, and pass nitrogen protection into the reactor;

[0067] 3. Raise the temperature to an internal temperature of 70°C, add 100 parts by weight of HT-600 at a uniform speed within 2.5 hours, and control the internal temperature to not exceed 90°C;

[0068] 4. Keep the internal temperature at 80-90°C for 3 hours after feeding;

[0069] 5. Take a sample and titrate the -NCO content with the di-n-butylamine method. When the test result is 0, get MCY-51.

preparation example 2

[0071] The preparation method of MCY-22 (hydroxyl-terminated polyurethane prepolymer) is as follows:

[0072] 1. Vacuum dehydrate PEG-600 at 120°C for 2 hours;

[0073] 2. Add 315 parts by weight of PEG-600 and 0.5 parts by weight of dibutyltin dilaurate catalyst into the reactor, stir and mix well, and pass nitrogen protection into the reactor;

[0074] 3. Raise the temperature to an internal temperature of 70°C, add 100 parts by weight of HT-100 at a constant speed within 2 hours, and control the internal temperature to not exceed 90°C;

[0075] 4. Keep the internal temperature at 80-90°C for 3 hours after feeding;

[0076] 5. Take a sample and titrate the -NCO content with the di-n-butylamine method. When the test result is 0, get MCY-22.

preparation example 3

[0078] The preparation method of MCY-23 (hydroxyl-terminated polyurethane prepolymer) is as follows:

[0079] 1. Vacuum dehydrate PEG-200 at 120°C for 2 hours;

[0080] 2. Add 110 parts by weight of PEG-200 and 0.5 parts by weight of dibutyltin dilaurate catalyst into the reactor, stir and mix well, and pass nitrogen protection into the reactor;

[0081] 3. Raise the temperature to an internal temperature of 70°C, add 100 parts by weight of HT-600 at a uniform speed within 2.5 hours, and control the internal temperature to not exceed 90°C;

[0082] 4. Keep the internal temperature at 80-90°C for 3 hours after feeding;

[0083] 5. Take a sample and titrate the -NCO content with the di-n-butylamine method. When the test result is 0, get MCY-23.

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Abstract

The invention discloses a packaging adhesive for LED, a use method and application thereof. The packaging adhesive for LED comprises a component A and a component B. The component A comprises epoxy resin, an antioxidant and optional color paste. The component B comprises a curing agent, a hydroxyl-terminated polyurethane prepolymer, polyol, an accelerant and an optional ultraviolet absorbent. Thepackaging adhesive for LED disclosed by the invention has good cold and hot impact resistance and humidity and heat resistance.

Description

technical field [0001] The invention relates to an encapsulation glue for LEDs and a use method and application thereof. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, have the advantages of long life, low power consumption, small size, and environmental protection compared with traditional light sources. The packaging glue for LED is a packaging material that protects the LED chip and improves the luminous performance to a certain extent. Therefore, according to the different requirements of the application, there are different requirements for the performance of the encapsulant in terms of humidity and heat resistance, high temperature resistance, ultraviolet resistance, light transmittance, refractive index, adhesiveness, and mechanical strength. This kind of performance can be characterized by testing methods such as aging test, light transmittance, thermal shock, moisture absorption reflow soldering, e...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J175/08C09J11/04C09J11/06H01L33/56
CPCC09J163/00C09J11/04C09J11/06H01L33/56C08L2201/08C08L2203/206C08L2312/00C08L2205/06C08K2003/329C08L75/08C08K5/005C08K5/521C08K5/13C08K3/32C08K5/3475C08K5/1345
Inventor 庞凯敏马晨阳刘聪刘新平
Owner BEIJING KMT TECH
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