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Low-solid-content soldering flux for pressure hot melting welding solder paste spot coating and preparation method

A hot-melt welding technology with low solid content, which is applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of insufficient welding time, high welding temperature, and short welding time, etc., to reduce corrosion, The effect of low viscosity and not easy to solder ball

Active Publication Date: 2020-10-09
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But another part of the needle tube solder paste uses the pressure hot-melt welding process. This welding method is characterized by fixed-point welding and can protect products that are not resistant to high temperatures. The welding temperature is high and the welding time is short. Generally, the welding temperature for SnAgCu solder paste is 280 -380°C, due to the direct contact of the soldering head with the solder paste and the pressure, it is easy to fry the tin when using the solder paste for reflow soldering, resulting in a large number of solder beads
The soldering time is 3-4s, if the soldering time is too short, it is easy to cause problems of false soldering and poor tinning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A low-solid-content soldering flux for pressure hot-melt welding spot coating solder paste, the components and mass percentage of the flux are: 6% mixed dibasic acid, 9% adipic acid, 5% triethanolamine, 0.4% Benzotriazole, 0.6% 2-mercaptobenzothiazole, 28.412% glycerol, 42.618% 2-methyl-2,4-pentanediol, 1% thixotropic agent 6650, 2% Thixotropic agent V15, 2.84% of HM604 rosin, 2.13% of KE100 rosin.

[0020] The preparation method of the low-solid-content soldering flux for the pressure hot-melt welding point coating solder paste is as follows: HM604 rosin, KE100 rosin, 2-methyl-2,4-pentanediol, glycerol, thixotropic agent 6650, The thixotropic agent V15, benzotriazole and 2-mercaptobenzothiazole are heated and stirred together to dissolve, the stirring speed is 50rpm, and the temperature is set at 180°C. After they are completely dissolved and cooled to 140°C, add the active agent to mix the dibasic acid, Adipic acid and triethanolamine are stirred until completely dis...

Embodiment 2

[0023] A low-solid-content soldering flux for pressure hot-melt welding spot coating solder paste, the components and mass percentage of the flux are: 4% salicylic acid, 4% sebacic acid, 8% triethanolamine, 1% Benzotriazole, 1% 2-mercaptobenzothiazole, 32% glycerol, 48% 2-methyl-2,4-pentanediol, 0.5% thixotropic agent 6650, 0.5% Thixotropic agent V15, 0.6% HM604 rosin, 0.4% KE100 rosin.

[0024] The preparation method of the low-solid-content soldering flux for the pressure hot-melt welding point coating solder paste is as follows: HM604 rosin, KE100 rosin, 2-methyl-2,4-pentanediol, glycerol, thixotropic agent 6650, The thixotropic agent V15, benzotriazole and 2-mercaptobenzothiazole are heated and stirred together to dissolve, the stirring speed is 50rpm, the temperature is set at 185°C, and the active agents salicylic acid and decane are added when they are completely dissolved and cooled to 140°C Diacid and triethanolamine, stirred until completely dissolved, poured into a...

Embodiment 3

[0027] A low-solid-content soldering flux for pressure hot-melt soldering spot coating solder paste, the components and mass percentage of the flux are: 10% succinic acid, 12% tetracosic acid, 4% triethanolamine, 1% Benzotriazole, 0.5% 2-mercaptobenzothiazole, 27% glycerol, 38% 2-methyl-2,4-pentanediol, 0.5% thixotropic agent 6650, 2% Thixotropic agent V15, 3% HM604 rosin, 2% KE100 rosin.

[0028] The preparation method of the low-solid-content soldering flux for the pressure hot-melt welding point coating solder paste is as follows: HM604 rosin, KE100 rosin, 2-methyl-2,4-pentanediol, glycerol, thixotropic agent 6650, The thixotropic agent V15, benzotriazole and 2-mercaptobenzothiazole are heated and stirred together to dissolve, the stirring speed is 50rpm, the temperature is set at 180℃~185℃, and the active agent butanediol is added when it is completely dissolved and cooled to 140℃ Acid, lignoceric acid, triethanolamine, stir until completely dissolved, pour into a contain...

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PUM

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Abstract

The invention discloses a low-solid-content soldering flux for pressure hot melting welding solder paste spot coating and a preparation method. The soldering flux comprises, by mass, 8%-22% of organicacid, 4%-8% of organic amine, 1%-5% of a film forming agent, 1%-3% of a thixotropic agent, 1%-2% of a corrosion inhibitor and 60%-80% of a solvent. The soldering flux and SnAgCu spherical alloy powder can be prepared into needle tube solder paste, under the pressure hot melting welding condition, the welding effect is good under the condition that the welding time is very short, insufficient solder, tin beads and tin explosion are avoided, the content of condensate is small, and the viscosity of residues is low.

Description

technical field [0001] The invention belongs to the technical field of welding materials used for assembly of electronic components. Background technique [0002] With the development and update of electronic products, some new welding processes have emerged, such as wire welding, welding of power tubes, silicon controlled rectifiers, rectifier bridge stacks, heat sinks and other components. Solder paste cannot be printed directly, it needs to be applied directly Solder on the spot. Due to the different processes, the performance of the solder paste used is different. Traditional canned solder paste can only meet the SMT process, but not the dispensing process, and the market demand for needle solder paste for dispensing is increasing, and some of the needle solder paste uses reflow soldering. The soldering method does not have high requirements on the solder paste, the reflow time is longer, generally 240-270s, and the peak value of the reflow temperature is 245±5°C (for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/40
CPCB23K35/362B23K35/40
Inventor 卢梦迪武信秦俊虎白海龙何欢王艳南熊晓娇柳丽敏陈亚君郭宣霖
Owner 云南锡业新材料有限公司
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