A preparation method of meter-scale large single crystal high-index surface copper foil

Abstract

The invention provides a preparation method of meter-scale large single crystal high-index copper foil. The method uses commercial polycrystalline copper foil as a raw material, and prepares Cu(112) and Cu(113) by using a process of pre-oxidation protection and then annealing. , Cu(122), Cu(123), Cu(133), Cu(223), Cu(233), Cu(355) and other high-index surfaces and a series of meter-scale large single crystal high-index surface copper foils. The method proposed by the present invention solves the problems of Cu(112), Cu(113), Cu(122), Cu(123), Cu(133), Cu(223), Cu(233), Cu(355) and other high Due to the high price and preparation cost of index-faced single crystal copper foil and the lack of product supply in the market, through a very simple method, high-quality meter-level large single crystal Cu(112), Cu(113), Cu(122), Macro-production of Cu(123), Cu(133), Cu(223), Cu(233), Cu(355) and other high-index copper foils.

Description

technical field [0001] The invention relates to a method for preparing a series of meter-level large single-crystal high-index surface copper foils in large quantities by using industrial-grade copper foils based on pre-oxidation protection. Background technique [0002] Single crystal copper foil exhibits many unusual electrical, mechanical, adsorption, and catalytic properties due to its smooth surface without grain boundaries and strong anisotropy. For example, single crystal Cu has lower resistance and AC impedance than polycrystalline Cu. The important reason is that electron scattering occurs at the grain boundary of polycrystalline Cu. This excellent electrical property makes it suitable for traditional power transmission and the new generation of electronics industry The field has very broad market prospects; single crystal superalloys have better creep resistance because they avoid grain boundary slip; in addition, single crystal surfaces, especially large-area sing...

AI Technical Summary

Problems solved by technology

[0003] However, the current commercialized single crystal metals are generally prepared by bulk crystal growth or thin film deposition on the substrate, which is expensive and has a small area, which cannot meet its needs in the substrate, target market, microelectronics industry, and traditional power transmission. Large-scale application requirements in the field

At the same time, it is also impossible to accurately obtain high crystal plane index single crystal copper foil for special purposes.

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