Solar silicon wafer recycling treatment device

Abstract

The invention relates to a solar silicon wafer recycling treatment device. The solar silicon wafer recycling treatment device comprises a workbench, a clamping mechanism and cleaning mechanisms, wherein the clamping mechanism is mounted on the upper end face of the workbench, the cleaning mechanisms are arranged on the left side of the clamping mechanism, and the lower ends of the cleaning mechanisms are connected with the upper end face of the workbench. Solar silicon wafer recycling treatment is carried out by adopting the design concept of multiple structures with a cleaning effect, the adopted cleaning mechanisms can present a state of reciprocating in a front-back staggered mode, and thus the silicon wafer surface cleaning degree can be improved, and a concentrated treatment and collecting structure for cleared impurities is further arranged.

Description

technical field [0001] The invention relates to the technical field of silicon chip processing, in particular to a solar silicon chip recovery and reuse treatment device. Background technique [0002] The silicon element with a content of 25.8% in the earth's crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, it is destined to enter the large-scale market for solar cells. In terms of products, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics. Crystalline silicon solar cells have excellent characteristics such as high efficiency, low attenuation, and high reliability. Silicon wafers are important materials for making integrated circuits. Photolithography, ion implantation and other means can be used to make various semiconductor devices. The demand for semiconductor-grade polysilicon is 19,000 tons, which is...

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Problems solved by technology

[0003] 1. The method of clamping the silicon wafer with a relatively rigid structure is likely to cause a large deformation of the clamping part of the silicon wafer, and the silicon wafer as a whole cannot receive effective clamping force, and at the same time clean the surface of the silicon wafer The movement state of the structure is relatively simple, and the same one-way movement cleaning method is often used, and this method tends to cause a low degree of cleaning on the surface of the silicon wafer;

[0004] 2. During the cleaning process of the silicon wafer surface, the removed impurities tend to fly around and accumulate on the device structure and re-adsorb on the silicon wafer. However, the adsorbed impurities cannot be collected and processed in a timely and effective manner, and the flying Impurities can also easily have a certain impact on the cooperation and operation of the components

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