Heat dissipation structure of head-mounted intelligent terminal
A technology of intelligent terminal and heat dissipation structure, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of affecting user experience, poor sensory experience, scattering, etc., and solve the problem of the main chip Heating and hot case, improve user experience, solve the effect of performance degradation
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Embodiment 1
[0040] Embodiment one, combine figure 2 with 3 as shown, figure 2 It is an exploded view of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention, image 3 It is a top view of Embodiment 1 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention (without a top cover); the head-mounted intelligent terminal includes a top cover 210, a housing 220, a PCB board 100 and a transparent mask 230, and the PCB board 100 is provided with Main chip 101; PCB board 100 is horizontally placed on the middle and upper part in the shell 220, and the micropump 120 is fixed on the left end in the shell 220; The transparent face shield 230 is positioned on the front side wall of the shell 220, and the water inlet joint 231a of the transparent face shield 230 and The water outlet connectors 231b are located in the housing 220 ; the cold plate 110 is located on the main chip 101 of the PCB 100 ,...
Embodiment 2
[0044] Embodiment two, combine Image 6 with 7 as shown, Image 6 It is an exploded view of Embodiment 2 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention, Figure 7 It is a top view of Embodiment 2 of the heat dissipation structure of the head-mounted intelligent terminal of the present invention (without a top cover state); the head-mounted intelligent terminal includes a top cover 210, a shell 220, a PCB board 100, a transparent mask 230 and a headband 240; and The difference in Embodiment 1 is that the rear radiator 250 is connected to the rear of the head-mounted smart terminal via the headband 240; the rear radiator 250 is composed of fins 251 and a substrate 252, and the materials of the fins 251 and substrate 252 can be uniform. Aluminum alloy or magnesium alloy or other light metals with high thermal conductivity are used. The fins 251 are welded on the base plate 252 , and the base plate 252 is connected to the head...
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