PCB solder mask production process

Abstract

The invention discloses a PCB solder mask production process. The PCB solder mask production process comprises the following steps of: raw material preparation, bonding pad exposing, film stacking, stacked film fixing, high-temperature hot press molding, baking and curing. Compared with the traditional PCB production process, the PCB solder mask production process provided by the invention has theadvantages that zero emission is realized through the solder mask process, water and electricity are saved, and the production cycle of the process can be greatly shortened; the PCB can be enabled tohave a considerable bending property; the production process comprises the following steps of: coating one sides of polyimide films (PI) with a semi-cured epoxy resin adhesive (or semi-solid acrylicacid), cutting windowing positions of PCB bonding pads on the polyimide films (PI) by processes like laser or die punching, then stacking and fixing the windowed polyimide films (PI) on a PCB body ina stacking mode, and performing pressing and forming in a high-temperature fast pressing mode, thus finally obtaining a solder mask superior to printing ink. The process saves water, electricity and labor, improves the production efficiency, and is environment-friendly and pollution free.

Description

technical field [0001] The invention belongs to the technical field of PCB solder mask production, and more specifically relates to a PCB solder mask production process. Background technique [0002] PCB is a printed circuit board, referred to as a printed board, and is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, printed circuit boards must be used. plate. The printed circuit board is composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components, and has the dual functions of a conductive line and an insulating base plate. It can replace complex wiring and realize the electrical connection betw...

AI Technical Summary

Problems solved by technology

[0004] The traditional PCB production process produces many pollutants, among which the production processes such as electroplating, wiring, and solder mask produce the most pollutants; and the traditional PCB production process also consumes a lot of water and electricity

For example, the traditional solder resist process needs to use special PCB inks for printing, pre-baking, alignment, exposure, development, post-baking and other processes to make pad windows. This process consumes a lot of hydropower and energy and has low production efficiency. Moreover, a large amount of organic waste water and waste gas are produced, and the production cost is also high.

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