Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Adhesive composition, packaging film, and organic electronic device containing packaging film

A technology of organic electronic components and adhesives, applied in the direction of adhesive types, electrical solid devices, ester copolymer adhesives, etc., can solve problems to be studied, etc., to avoid material deposition, high transparency, and improve peel strength Effect

Active Publication Date: 2020-09-01
CHINA LUCKY FILM CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, current adhesives for encapsulating organic electronic components are still under investigation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive composition, packaging film, and organic electronic device containing packaging film
  • Adhesive composition, packaging film, and organic electronic device containing packaging film
  • Adhesive composition, packaging film, and organic electronic device containing packaging film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] (1) Preparation of siloxanated polyisobutylene

[0070] Add 50 parts by weight of heptamethylhydrotrisiloxane and toluene into a four-necked flask equipped with a stirrer, a thermometer and a reflux condenser. Under the condition that nitrogen is the protective gas, add 75 parts by weight of high-activity polyisobutylene (LPIB, molecular weight is 400) with a funnel and stir, add 1 part by weight of isopropyl alcohol of chloroplatinic acid as a catalyst, control the reaction temperature at 90 ° C, and react About 6 hours. Then the product is distilled under reduced pressure to remove low boilers to generate siloxanated polyisobutene.

[0071] (2) Preparation of acrylate copolymer

[0072] Add 90 parts by weight of butyl methacrylate, 5 parts by weight of 2-hydroxyethyl acrylate, 4 parts of acrylonitrile monomer mixture and 1 part by weight of glycidyl methacrylate crosslinking agent to the cooling system To facilitate the reflux of nitrogen and temperature control in...

Embodiment 2

[0081] (1) The preparation of siloxanated polyisobutylene is the same as in Example 1, wherein the molecular weight of the polyisobutylene used is 950.

[0082] (2) The preparation of acrylate copolymer is the same as in Example 1.

[0083] (3) Preparation of adhesive composition

[0084] 5 parts by weight of silica was added to toluene, stirred and mixed, and then dispersed with an ultrasonic generator for about 1 hour, thereby preparing a dispersion with a solid content of 5% by weight.

[0085] 4.8 parts by weight of siliconized polyisobutylene resin, 1 part by weight of hydrogenated petroleum resin, and 4.6 parts by weight of acrylate copolymer were added to toluene so that the solid content was 15% by weight. Add 1.5 parts by weight of silica dispersion, 2.8 parts by weight of γ-aminopropyltriethoxysilane (KH550), 0.05 parts by weight of toluene diisocyanate (TDI), and dilute the resulting mixture to a solid content of 10%. An adhesive composition is obtained.

[0086]...

Embodiment 3

[0089] (1) The preparation of siloxanated polyisobutylene is the same as that in Example 1, wherein the molecular weight of the polyisobutylene used is 1400.

[0090] (2) The preparation of acrylate copolymer is the same as in Example 1.

[0091] (3) Preparation of adhesive composition

[0092] 5 parts by weight of titanium dioxide was added to toluene, stirred and mixed, and then dispersed with an ultrasonic generator for about 1 hour, thereby preparing a dispersion with a solid content of 5% by weight.

[0093] 13 parts by weight of siliconized polyisobutylene resin, 6 parts by weight of hydrogenated petroleum resin, and 10 parts by weight of acrylate copolymer were added to toluene so that the solid content was 30% by weight. Add 4.3 parts by weight of titanium dioxide dispersion, 4.5 parts by weight of γ-acetoacetate propyl trimethoxysilane, 0.02 parts by weight of toluene diisocyanate (TDI), and dilute the resulting mixture to a solid content of 27%, to obtain an adhesiv...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an adhesive composition. The adhesive composition comprises siloxane polyisobutylene, a tackifier, an acrylate copolymer, a moisture absorbent, a silane coupling agent and a solvent. An adhesive layer formed by the adhesive composition provided by the invention has good water-oxygen barrier capacity, peel strength and weather resistance, can effectively prevent moisture or oxygen from flowing into a packaged organic electronic device from an external environment under high-temperature and high-humidity conditions, realizes transparency, excellent durability, reliabilityand adhesiveness, and has a good application prospect.

Description

technical field [0001] The present invention relates to the field of materials. Specifically, the present invention relates to an adhesive composition, an encapsulating film, and an organic electronic device including the encapsulating film. Background technique [0002] Organic electronic devices refer to devices that use holes and electrons to generate alternating currents of organic material layers, including photovoltaic devices, rectifiers, transistors, and organic light-emitting diodes (OLEDs). [0003] Taking an organic light emitting diode (OLED) as an example, an organic light emitting diode generally includes a layer made of a functional organic material present between a pair of electrodes comprising a metal or a metal oxide. Oxygen permeating into the OLED may cause oxidation of the electrodes, and moisture permeating into the OLED may cause corrosion of the electrodes or decomposition of organic materials. In addition, oxygen or moisture may cause separation b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/26C09J133/10C09J11/04C09J11/06C09J11/08C09J7/25C09J7/30H01L51/10H01L51/44H01L51/52
CPCC09J123/26C09J11/04C09J11/06C09J11/08C08L2205/03C08L2203/206C08L2201/14C08L2201/10C09J2467/006C08K2003/2241H10K10/88H10K30/88H10K50/844C08L33/20C08K3/36C08K5/544C08K5/29C08K3/22C08K5/5419C08K5/5475Y02E10/549
Inventor 王茜姜伟刘孟李娜许士鲁
Owner CHINA LUCKY FILM CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com