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Preparation method of fluorine-containing polymer/polyimide composite film

A polyimide and composite film technology is applied in the field of preparation of fluorine-containing polymer/polyimide composite films, and can solve the problem of improving the dielectric constant and dielectric loss of the fluorine-based resin/polyimide composition. Environmental problems such as adverse effects, to achieve the effect of reducing dielectric constant, avoiding pollution, and reducing density

Active Publication Date: 2020-08-07
DONGGUAN DONGYANG SOLAR SCI RES & DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, surfactants and dispersants containing fluorine will increase the dielectric constant and dielectric loss of the fluororesin / polyimide composition
[0006] In addition, when the fluororesin / polyimide composition containing fluorine-containing surfactants and dispersants is imidized, or when the waste liquid is incinerated, hydrogen fluoride may be generated due to thermal decomposition, which has a negative impact on the environment. cause adverse effects

Method used

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  • Preparation method of fluorine-containing polymer/polyimide composite film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Add 6.0g of PTFE powder and 51g of NMP into the ball mill tank, carry out planetary ball milling at 500rpm for 24h, and obtain a dispersion in which PTFE powder is uniformly dispersed in NMP, and 3.6967g of 3,3'-dihydroxybenzidine (0.0171mol) and the above Add the dispersion into a four-neck flask, pass N 2 Protect, stir mechanically to completely dissolve 3,3'-dihydroxybenzidine, then add 5.3033g ODPA (0.0171mol) in 4 batches, with an interval of 15min between each batch, after adding all ODPA, continue stirring at 25°C for 24 hours, Add 7.9508g of heptafluorobutyryl chloride (0.0342mol), heat the reaction solution to 80°C, continue to stir and continue the reaction for 24 hours to obtain a fluoropolymer / polyamic acid combination solution, a fluoropolymer / polyamic acid combination solution Carry out defoaming treatment, after defoaming, apply it on a glass plate, and heat it in a vacuum oven at 100°C for about 30 minutes to remove most of the solvent, and then place it...

Embodiment 2

[0043] Add 6.0g of PTFE powder and 51g of NMP into the ball mill tank, carry out planetary ball milling at 500rpm for 24h, and obtain a dispersion in which PTFE powder is uniformly dispersed in NMP, and 3.6967g of 3,3'-dihydroxybenzidine (0.0171mol) and the above Add the dispersion into a four-neck flask, pass N 2 Protect, stir mechanically to completely dissolve 3,3'-dihydroxybenzidine, then add 5.3033g ODPA (0.0171mol) in 4 batches, with an interval of 15min between each batch, after adding all ODPA, continue stirring at 25°C for 24 hours, Add 3.9754g of heptafluorobutyryl chloride (0.0171mol), heat the reaction solution to 80°C, continue to stir and continue the reaction for 24 hours to obtain a fluoropolymer / polyamic acid combined solution, a fluoropolymer / polyamic acid combined solution Carry out defoaming treatment, after defoaming, apply it on a glass plate, and heat it in a vacuum oven at 100°C for about 30 minutes to remove most of the solvent, and then place it in a ...

Embodiment 3

[0045] Add 6.0g of PTFE powder and 51g of NMP into the ball mill tank, and carry out planetary ball milling at 500rpm for 24h to obtain a dispersion in which PTFE powder is uniformly dispersed in NMP, and 1.8769g of 3,3'-dihydroxybenzidine (0.0087mol), Add g 4,4'-ODA (0.0087mol) and the above dispersion into a four-necked flask, pass N 2 Protect, stir mechanically to dissolve 3,3'-dihydroxybenzidine and 4,4'-ODA completely, then add 5.3852g ODPA (0.0174mol) in 4 batches, with an interval of 15min between each batch, after all ODPA is added, put it at 25°C Continue to stir and continue to react for 24 hours, add 4.0452g of heptafluorobutyryl chloride (0.0174mol), heat the reaction solution to 80°C, continue to stir and continue to react for 24 hours, you can obtain a fluoropolymer / polyamic acid combination solution, fluoropolymer After degassing, apply it on a glass plate, and heat it in a vacuum oven at 100°C for about 30 minutes to remove most of the solvent, and then place i...

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Abstract

The invention relates to a preparation method of a fluorine-containing polymer / polyimide composite film; raw materials comprise a fluorine-containing polymer, a diamine monomer, a dianhydride monomerand a fluorine-containing modifier, and the diamine monomer comprises aromatic diamine containing hydroxyl; the fluorine-containing modifier is fluorine-containing alkane containing an acyl chloride group or an anhydride group. By adopting the hydroxyl-containing aromatic diamine and the fluorine-containing modifier, the side chain of the prepared polyimide is grafted with a fluorine-containing side chain group, so that the compatibility with fluorine resin is improved, and the use of a fluorine-containing surfactant is avoided. Through the preparation method, the dielectric constant and the dielectric loss of the polyimide film are remarkably reduced.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a preparation method of a fluorine-containing polymer / polyimide composite film. Background technique [0002] With the advancement of high-speed and high-function electronic equipment, the demand for high-speed communication speed is also increasing. Among them, low dielectric constant and low dielectric loss tangent are required for various electronic equipment materials, and in particular, low dielectric constant and low dielectric loss tangent are required for insulating materials and substrate materials. [0003] Polyimide (PI) has been widely used in the electronics industry, such as printed circuit board materials, due to its good heat resistance, chemical resistance, mechanical strength and high electrical resistance. However, polyimide film itself has a high dielectric constant and a high dielectric loss factor. As a high-frequency material, there are still short...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08L27/18C08G73/10
CPCC08J5/18C08G73/1071C08G73/1039C08G73/1007C08J2379/08C08J2327/18Y02E60/10
Inventor 李义涛邓永茂云晧张凌飞程堂剑陈志钊林丽平杨刚
Owner DONGGUAN DONGYANG SOLAR SCI RES & DEV CO LTD
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