Heat dissipation structure of high-density digital power supply and power supply assembly

Abstract

The invention provides a heat dissipation structure of a high-density digital power supply and a power supply assembly. The heat dissipation structure comprises a 3U case, a red copper radiator, a flow guide cover and a vapor chamber radiator, wherein functional modules form a convective heat exchange path in a cavity of the power supply case, the red copper radiator can rapidly exchange heat generated by a rectifier diode and an absorption resistor to the outside of the box body in an air convection mode, the vapor chamber radiator can further rapidly exchange heat generated by an insulated gate bipolar transistor to the outside of the box body in an air convection mode, therefore, the temperature rise of a heat-sensitive device mounting area of a rectifying circuit layout is reduced. Theheat dissipation structure is advantaged in that a heat dissipation channel is redefined and is improved on the basis of an original channel, temperatures of a rectifier diode, a resistor mounting area and an insulated gate bipolar transistor are reduced, and the service life of the device is prolonged; the working temperature of a power tube is reduced, and problems of power tube failure and system high-temperature shutdown protection are effectively solved.

Description

technical field [0001] The invention belongs to the field of power supplies, and in particular relates to a heat dissipation design method for a DC / DC high-density digital power supply, which is mainly used for the heat dissipation design of products such as various power supplies, rectifiers, inverters, voltage converters, and current converters, to ensure related The product can perform various functions and work reliability under full load conditions. Background technique [0002] With the rapid development of electronic technology, the integration degree and power density of integrated devices are increasing day by day, coupled with the need for miniaturization of electronic equipment in special fields, power supply products are gradually developing towards high density, and the heat flux density of power supply products is doubled Increase. In addition to successfully realizing the functions of the product, the power product designer must also fully consider the produc...

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Problems solved by technology

[0005] 1. After the original heat dissipation design increases the forced air cooling flow of the system, the heat dissipation effect is not significantly improved;

[0006] 2. In the original products, the diodes and resistors are basically working at the temperature limit and under full load;

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