Production process of mobile phone heat dissipation plate

Abstract

The invention discloses a production process of a mobile phone heat dissipation plate. The production process comprises the following steps of firstly, establishing a developing plate type, setting aplurality of developing areas, enabling two rows of plates in each developing area to form a 180-degree complementary structure, and collinearly setting a second edge of an L-shaped copper plate mainbody in any row of plates; then performing developing and etching operation, then performing double-row cutting on a developing area, linearly connecting second edges of multiple L-shaped copper platebodies on the cutting plate into a whole, and forming first edges through cutting; and then synchronously bending and forming the multiple first edges, and finally synchronously stamping and cuttingsecond edges. The production process is advantaged in that production molding of a specific mobile phone heat dissipation plate can be realized, the high-precision molding requirement of a plate-shaped structure main body is met through a development etching process, moreover, the ingenious development pattern design is utilized to meet the continuous row synchronous bending requirement and improve uniformity of finished products, the mobile phone heat dissipation plate can meet the heat dissipation requirement of electronic equipment with high-difference power consumption elements, and attaching stability and the matching degree between the mobile phone heat dissipation plate and all the power consumption elements are high.

Description

technical field [0001] The invention relates to a production process of a cooling plate for a mobile phone, and belongs to the technical field of the production process of a cooling plate. Background technique [0002] The literal translation of VC (Vapor Chambers) is steam chamber, and it is generally called vapor chamber, vapor chamber, and vapor chamber in the industry. With the continuous improvement of chip power density, VC has been widely used in the heat dissipation of high power consumption devices such as CPU, NP, and ASIC. [0003] The design of electronic devices such as mobile phones and notebooks is getting thinner and thinner, so the heat dissipation requirements for their internal power consumption devices are getting higher and higher. Traditional heat sinks such as heat pipes can no longer meet the ultra-thin design requirements, and general heat dissipation copper plates are also difficult to meet. Its heat dissipation needs, so the design of VC vapor cha...

AI Technical Summary

Problems solved by technology

[0003] The design of electronic devices such as mobile phones and notebooks is getting thinner and thinner, so the heat dissipation requirements for their internal power consumption devices are getting higher and higher. Traditional heat sinks such as heat pipes can no longer meet the ultra-thin design requirements, and general heat dissipation copper plates are also difficult to meet. Its heat dissipation needs, so the design of VC uniform temperature plate appeared

[0004] The VC uniform temperature plate is covered and sealed by two layers of metal plates to form a vacuum chamber, which has a mesh filling layer and is vacuum filled with cooling medium. In the prior art, the metal bottom plate of the VC uniform temperature plate is a flat structure, while There are a large number of power consumption devices arranged at intervals in electronic equipment. In order to fit the VC uniform temperature plate, the top surface of the power consumption device needs to be designed flush. This increases the design cost and has a high impact on the assembly accuracy. Require

However, it is very difficult to make the bottom plate of the VC uniform temperature plate into a curved structure. The size of the single plate is small, and the etching operation is cumbersome. The bending operation of the single plate is poorly uniform, which affects the later VC uniform temperature plate. to assemble

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