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A kind of preparation method of high-purity copper rotating target

A high-purity copper, rotating target technology, applied in the field of rotating targets, can solve the problems of easy deformation, poor rigidity, low material strength, etc., to meet the needs of use, improve stability, and avoid the effect of grain growth

Active Publication Date: 2021-02-26
东莞市欧莱溅射靶材有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

High purity also feels that the material has low strength, poor rigidity and easy deformation

Method used

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  • A kind of preparation method of high-purity copper rotating target
  • A kind of preparation method of high-purity copper rotating target
  • A kind of preparation method of high-purity copper rotating target

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Embodiment Construction

[0045] The following are only preferred embodiments of the present invention, and therefore do not limit the protection scope of the present invention.

[0046] A method for preparing a high-purity copper rotating target, comprising the following steps:

[0047] 1) Ingot pretreatment step: heat and heat-preserve the high-purity copper round ingot, then upsetting, so that the high-purity copper round ingot forms a high-purity copper ingot, and rounds and elongates the high-purity copper ingot to form a round ingot , the round ingot is subjected to preliminary machining to obtain a pretreated copper ingot of a set size; preliminary machining refers to removing the scale of the round ingot and the two ends of the round ingot, including the following sub-steps:

[0048] 1.1) One upsetting sub-step, the high-purity copper round ingot is subjected to three-way forging to obtain a primary square ingot, so that the side length of the primary square ingot is increased by 15% to 20% com...

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Abstract

The invention discloses a method for preparing a high-purity copper rotary target, which comprises 1) a billet pretreatment step, 2) a precision tube-making step, 3) target composite structure processing and welding, and 4) a target stabilization treatment step. Through the preparation method of the high-purity copper rotary target of the present invention, the obtained crystal grain structure is uniform, the crystal grains are refined, and the rotary target structure has strong stability.

Description

technical field [0001] The invention relates to the technical field of rotating targets, in particular to a method for preparing a high-purity copper rotating target. Background technique [0002] The TFT industry, that is, the thin-film transistor industry, is currently the field with the largest demand for copper coating. Due to the requirements of copper film coating, etching and conductivity, TFT targets generally require a purity of more than 99.99%, uniform grain density, and a grain size not exceeding 50 microns, the shape and surface roughness requirements are equally stringent. [0003] The impurity content of high-purity copper material is low, the grain boundary is easy to migrate, and the grain is easy to grow in the high temperature environment of thermal processing. High purity also feels that the material has low strength, poor rigidity and easy deformation. The magnetron sputtering process is based on the precise control of the electromagnetic field, which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C37/08B21J5/00B21J5/06B21J5/08C23C14/34
CPCB21C37/08B21J5/002B21J5/06B21J5/08B23P15/00C23C14/3414
Inventor 文宏福吴本明张中美
Owner 东莞市欧莱溅射靶材有限公司
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