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Copper-zirconium alloy for electronic components and preparation method thereof

A technology for electronic components and copper-zirconium alloy, applied in the field of copper-zirconium alloy for electronic components and its preparation, can solve the problems of high cost of Ag element, high cost of industrialization, unfavorable promotion, etc., achieve low cost and improve comprehensive performance , the effect of reducing oxidative loss

Active Publication Date: 2021-03-19
CHINALCO MATERIALS APPL RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cost of adding Ag element in this patent is too high, and it is prepared by vacuum smelting, so the industrialization cost is high, which is not conducive to popularization

Method used

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  • Copper-zirconium alloy for electronic components and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Melting: Put copper into an induction melting furnace, add charcoal and flake graphite, melt under an argon protective atmosphere, and perform degassing treatment to obtain a copper melt;

[0030] (2) Alloying: adding the master alloys Cu-10wt%Mg, Cu-15wt%Si, Cu-10wt%La, Cu-15wt%Zr into the furnace in turn, keeping the temperature until completely melted to obtain a copper alloy melt;

[0031] (3) Casting: casting the copper alloy melt obtained in step (2) at a casting temperature of 1180° C. to obtain a slab of 200×600 mm in size, the components are Zr 0.05wt%, Mg 0.17wt%, Si 0.06wt%, La 0.06 wt%, the balance is Cu and unavoidable impurities;

[0032] (4) Hot rolling: hot rolling and online quenching are carried out to the copper alloy cast slab obtained in step (3), the hot rolling heating temperature is 880°C, the heat preservation is 4h, the final rolling temperature is 700°C, and the thickness of the hot rolled slab is 16mm;

[0033] (5) Rough rolling: carry o...

Embodiment 2

[0039] (1) Melting: Put copper into an induction melting furnace, add charcoal and flake graphite, melt it under a nitrogen protective atmosphere, and perform degassing treatment to obtain a copper melt;

[0040] (2) Alloying: adding the master alloys Cu-10wt%Mg, Cu-15wt%Si, Cu-10wt%Ce, Cu-15wt%Zr into the furnace in turn, keeping the temperature until completely melted to obtain a copper alloy melt;

[0041] (3) Casting: casting the copper alloy melt obtained in step (2) at a casting temperature of 1200° C. to obtain a slab of 200×600 mm in size, the components are Zr 0.11wt%, Mg 0.1wt%, Si 0.03wt%, Ce 0.05 wt%, the balance is Cu and unavoidable impurities;

[0042] (4) Hot rolling: hot rolling and online quenching are carried out to the copper alloy cast slab obtained in step (3), the hot rolling heating temperature is 900°C, the heat preservation is 4h, the final rolling temperature is 720°C, and the thickness of the hot rolled slab is 16mm;

[0043] (5) Rough rolling: car...

Embodiment 3

[0049] (1) Melting: Put copper into an induction melting furnace, add charcoal and flake graphite, melt under an argon protective atmosphere, and perform degassing treatment to obtain a copper melt;

[0050] (2) Alloying: Add the master alloys Cu-10wt%Mg, Cu-15wt%Si, Cu-10wt%Y, Cu-15wt%Zr into the furnace in sequence, and keep warm until completely melted to obtain a copper alloy melt;

[0051] (3) Casting: casting the copper alloy melt obtained in step (2) at a casting temperature of 1250° C. to obtain a slab of 200×600 mm in size, with components of Zr 0.2wt%, Mg 0.2wt%, Si 0.08wt%, Y 0.05 wt%, the balance is Cu and unavoidable impurities;

[0052] (4) Hot rolling: hot rolling and online quenching are carried out to the copper alloy cast slab obtained in step (3), the hot rolling heating temperature is 920°C, the heat preservation is 4h, the final rolling temperature is 700°C, and the thickness of the hot rolled slab is 16mm;

[0053] (5) Rough rolling: carry out cold rolli...

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Abstract

The invention discloses a copper-zirconium alloy for an electronic component and a preparation method of the copper-zirconium alloy. The copper-zirconium alloy comprises the following alloy componentsincluding, by weight, 0.05%-0.4% of Zr, 0.05%-0.2% of Mg, 0.03%-0.15% of Si, 0.01%-0.06% of rare earth and the balance Cu and inevitable impurity elements. The invention further discloses the preparation method of the alloy. The preparation method comprises the steps of melting, alloying, casting, hot rolling, rough rolling, aging, finish rolling, stress relief annealing and finished product treatment. The copper-zirconium alloy has high strength, high conductivity and excellent bending processability under the influence of the comprehensive action of the added Mg, Si and rare earth elements,the preparation method of the alloy easily achieves engineering production and is low in cost, the tensile strength of a finished strip is not less than 560 MPa, the conductivity is not less than 80%IACS, and the product can be used for a tremendous-scale integrated circuit, a large-current electronic element and a heat dissipation component.

Description

technical field [0001] The invention relates to the technical field of nonferrous metal processing, in particular to a copper-zirconium alloy for electronic components and a preparation method thereof. Background technique [0002] Copper-zirconium alloy has a conductivity as high as 90-95% IACS and has high heat resistance. It is often used as a copper alloy for electronic components such as high-power lead frames and electronic connectors. With the rapid development of high-tech fields such as microelectronics, communications, transportation, aerospace, and aviation, electronic components are also developing in the direction of high integration, miniaturization, and thin-walled, and the transmission volume and heat generation of electronic components are increasing. This puts forward higher requirements for copper alloy materials. In addition to having high electrical and thermal conductivity and heat resistance, it also needs to have high strength. An alloy material with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/03C22F1/08
CPCC22C1/03C22C9/00C22F1/08
Inventor 娄花芬张曦向朝建莫永达黄东男王金华陈忠平杨春秀王虎
Owner CHINALCO MATERIALS APPL RES INST CO LTD
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