Tin coating nozzle and device

Abstract

The method is suitable for the technical field of integrated circuit welding, and discloses a tin coating nozzle and a tin coating device. The tin coating nozzle comprises a nozzle body provided witha tin outlet, the nozzle body is provided with an arc-shaped inclined plane enabling liquid soldering tin to flow from the surface of the nozzle body to form a soldering tin film, and the thickness ofthe soldering tin film is gradually reduced from top to bottom. Due to the fact that the arc-shaped inclined face is arranged on the outer side surface of the nozzle body, when the tin outlet amountis constant, a tin film which is gradually thinned from top to bottom is formed when tin flows through the nozzle body with the arc-shaped inclined face. During tin coating, the positions of pins passing through the tin film are determined according to the density of the pins for tin coating, it can be guaranteed that the contact area between the pin faces of a device and the arc-shaped inclined face is small through the surface arc face structure during tin coating, meanwhile, under the combined action of momentum generated in the process that tin flows from top to bottom, the continuous tinphenomenon is not likely to be formed between the two pins in the tin coating process, and the continuous tin phenomenon during enameling welding is avoided.

Description

technical field [0001] The invention relates to the technical field of integrated circuit welding, in particular to a tinning nozzle and a device. Background technique [0002] Pre-soldering is to pre-wet the lead wires of the components to be soldered or the conductive soldering parts with solder, generally also known as tinning, tinning, tinning or hanging tin. There are two main types of tin tanning machines: ordinary tin tanning machine and ultrasonic tin tanning machine. Due to the different sizes and distribution densities of tinned pins, the difficulty of tinned process varies. [0003] At present, the flat water-curtain tin film formed by the spout commonly used in tinning equipment can only meet the minimum pitch of 0.3mm for tinning. However, the minimum pin spacing of common integrated circuits is 0.2mm. At the same time, with the development trend of integrated circuits, the functions of integrated circuits are becoming larger and larger, their area is limited,...

AI Technical Summary

Problems solved by technology

[0003] At present, the flat water curtain tin film formed by the nozzle usually used in tinning equipment can only meet the minimum pitch of 0.3mm for tinning. However, the minimum pin spacing of common integrated circuits is 0.2mm.

At the same time, with the development trend of integrated circuits, the functions of integrated circuits are becoming larger and larger, their area is limited, and the density of integrated circuit pins is increasing. The use of existing technologies is likely to cause solder connection between two pins, resulting in integrated circuits. There is a short circuit between the circuit pins. Therefore, it can neither meet the requirements of the pins of the existing integrated circuits to remove gold and tin, nor can it meet the requirements of the development trend of integrated circuits for tin plating.

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