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How to use the shared pad structure compatible with antenna soldering and thimble testing

A pad and antenna technology, applied in the field of shared pad structure, can solve the problem that the pad is not compatible with antenna welding and thimble testing functions at the same time, so as to improve production and testing efficiency, prevent tin connection phenomenon, and reduce occupancy. area effect

Active Publication Date: 2017-09-19
深圳市磊科实业有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for using a shared pad structure compatible with antenna welding and thimble testing, mainly to solve the problem that the pads on the router PCB substrate do not have the functions of compatible antenna welding and thimble testing at the same time

Method used

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  • How to use the shared pad structure compatible with antenna soldering and thimble testing
  • How to use the shared pad structure compatible with antenna soldering and thimble testing

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Embodiment

[0030] Such as figure 1 , 2 As shown, the present invention includes a first pad 1, a second pad 2, a third pad 3, a fourth pad 4 and a corresponding layer 5 for which copper is prohibited, and all components are arranged on the front or back of the PCB substrate . The second pad 2 and the third pad 3 are arranged symmetrically on the fourth pad 4 , and the first pad 1 is connected to the positive pole of the antenna and located outside the fourth pad 4 . The copper-forbidden corresponding layer 5 completely covers the surface of the first pad, and extends between the second pad 2 and the third pad 3, completely separating the second pad from the third pad. The so-called copper-forbidden corresponding layer means that copper is prohibited to be laid in this area, which is used as the adjacent ground between each pad, and is mainly used to prevent the WIFI signal from being affected. And the extended isolation part 6 between the first pad, the second pad and the third pad th...

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Abstract

The invention discloses a shared pad structure compatible with antenna welding and thimble testing and a use method thereof, which solves the problem that the pads on the router PCB substrate do not have the functions of simultaneously compatible antenna welding and thimble testing. The present invention includes a first pad, a second pad, a third pad and a fourth pad that are jointly arranged on the front or back of the PCB substrate; the second pad and the third pad are symmetrically arranged on the fourth pad , and the second pad, the third pad and the fourth pad are grounded at the same time; the first pad is located outside the fourth pad, and its surface is covered with a corresponding layer of forbidden copper; the corresponding layer of forbidden copper and The fourth pad is connected integrally and extends to between the second pad and the third pad to completely isolate the second pad from the third pad. The invention has a reasonable structure, is convenient to use, and is compatible with antenna welding and thimble testing, thus greatly improving production efficiency and being suitable for popularization and application.

Description

technical field [0001] The invention relates to a pad structure, in particular to a method for using a common pad structure compatible with antenna welding and thimble testing. Background technique [0002] At present, the pads used for thimble testing on the router PCB substrate and the pads for antenna welding are completely separated and independent in design and use, that is: when the thimble needs to be tested, the thimble test pad is designed; when the antenna needs to be soldered , Design the pad for antenna soldering. At present, there is no PCB substrate that has both designed thimble test pads and antenna solder pads. However, to realize its basic functions, the router PCB substrate must pass the thimble test and must also solder the antenna. Disc and antenna welding pads not only bring great trouble to the technical design work, but also bring a lot of inconvenience to the production process of the PCB substrate, which seriously affects the mass production of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11
Inventor 彭珊
Owner 深圳市磊科实业有限公司
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