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Method for preventing connected tin forming in wave soldering

A technology of soldering tin and wave soldering, which is applied in the direction of welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of decreased solder fluidity, aggravated wave soldering joint tin generation, accelerated solder oxidation, etc. The effect of defect elimination and avoiding the formation of solder joint phenomenon

Inactive Publication Date: 2004-04-07
广州博士科技交流中心有限公司
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AI Technical Summary

Problems solved by technology

[0004] (2). The hot air knife (the gas is nitrogen or air) acts on the normal solder joints to produce different degrees of solder joint defects, which will damage the mechanical strength and reliability of the solder joints.
[0005] (3). The solder blown off by the hot air will form defects such as tin beads or tin balls on the circuit board
[0006] (4). The air hot air knife will accelerate the oxidation of solder in the wave soldering furnace, resulting in a decrease in the fluidity of the solder, which will intensify the occurrence of tin connection between the wave soldering joints

Method used

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  • Method for preventing connected tin forming in wave soldering
  • Method for preventing connected tin forming in wave soldering
  • Method for preventing connected tin forming in wave soldering

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Embodiment Construction

[0015] Before explaining the present invention, first describe the mechanism of connecting tin defects. We know that all wave soldering joints are not formed in tin waves even with tin. The amount of tin connection of the solder joint depends on the design of the circuit board, the activity of the flux when leaving the de-soldering point, and other factors. When the circuit board is separated from the tin wave, the amount of solder in the corresponding solder joint should have reached a certain saturation through capillary action. Only in this way can the solder bridge between adjacent solder joints be broken. Factors such as board design, solder mask type, and process conditions all ultimately determine the outcome of these force balances. Lian tin is usually in a critical steady state. When the solder joint leaves the tin wave, it is still in a capillary state. Usually, the central part of the deformation of the circuit board is the latest to leave the de-tinning point, so ...

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Abstract

The method for preventing wave soldering from forming tin connection includes the follow steps: in the front of detinning point of wave soldering equipment a nitrogen gas tube which possesses a longitudinal narrow opening and can blow out a transverse narrow gas stream to detinning point is placed, the nitrogen gas tube can be regulated to make the transverse narrow gas stream and circuit board to be soldered form an included angle between them, the gas stream rate and the above-mentioned included angle can be regulated before the soldering position of the circuit board is separated from the detining point, so that it can solve the tin connection defect in the wave soldering process.

Description

technical field [0001] The invention relates to wave soldering technology, in particular to a method capable of preventing wave soldering equipment from producing tin-connection defects during the soldering process. Background technique [0002] During the wave soldering process, the tin connection between the pins of fine-pitch devices is very difficult to eliminate. Due to product design, incoming material problems and other reasons, the on-site process parameter adjustment is difficult to overcome the tin connection defect. At present, in order to solve this problem, on the premise that the design and materials cannot be changed, the ideal method is to use hot air knife technology. At present, the existing hot air knife products are the selectX(TM) hot air knife of Soltec Company and the hot air knife of Electrovert Company. The former can repair the tin-connection defects that regularly appear on the circuit board through programming; the latter installs the hot air kn...

Claims

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Application Information

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IPC IPC(8): B23K31/00H05K3/34
Inventor 刘常康唐卫东
Owner 广州博士科技交流中心有限公司
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