Photoelectric module assembly with precise constant temperature control function and manufacturing method thereof

Abstract

The invention discloses a photoelectric module assembly with a constant temperature control function and a manufacturing method thereof. The photoelectric module assembly comprises a ceramic or glasssubstrate, a light emitting assembly, a light receiving assembly, an integrated circuit chip, a chip component, an NTC thin film resistor, a top metal electrode of the photoelectric module assembly and an integrated TEC thermoelectric cooler. The ceramic or glass substrate is used as a carrier, and the light emitting assembly, the light receiving assembly, the integrated circuit chip, the chip component, the NTC thin-film resistor and the like are integrated into a whole on the front surface of the ceramic or glass substrate. The integrated TEC thermoelectric cooler is organically integrated on the back surface of the ceramic or glass substrate, so that the temperature is accurately controlled, and the photoelectric performance parameters of the photoelectric module assembly are accuratelycontrolled. The photoelectric module assembly is widely applied to the fields of environmental atmosphere detection, communication, aerospace, aviation, ships, precise instruments, geological exploration, oil exploration, other field operations, industrial control and the like, and has a wide market prospect.

Description

technical field [0001] The invention relates to a photoelectric module assembly, in particular to a photoelectric module assembly with a precise constant temperature control function and a manufacturing method thereof. Background technique [0002] The original photoelectric module components with constant temperature control function are separated light emitting components (referred to as LD components), light receiving components (referred to as PD components), related integrated circuit chips, related electronic components, and negative temperature coefficient thermistors ( Referred to as NTC thin film resistors), separated semiconductor thermoelectric coolers (abbreviated as TEC thermoelectric coolers), etc., adopt traditional assembly technologies such as mounting and bonding, and are sealed in the shell in a clean environment, such as figure 1 shown. Due to the use of discrete assembly technology in the original technology, the volume is large, the assembly procedure ...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a photoelectric module assembly with precise constant temperature control function and its manufacturing method, the light emitting assembly (abbreviated as LD assembly), light receiving assembly (abbreviated as PD assembly), related integrated circuit chips, related electronic components , negative temperature coefficient thermistors (referred to as NTC thin film resistors), and semiconductor thermoelectric coolers (referred to as TEC thermoelectric coolers) are organically integrated into one body, which solves the problem of large volume and consistent process quality caused by discrete assembly technology Poor performance, insensitive temperature control, so that the photoelectric performance parameters of semiconductor lasers cannot be precisely controlled

Images