Alignment method, alignment system and computer readable storage medium

Abstract

An alignment method comprises the following steps: obtaining a corresponding relation table representing the corresponding relationship among multiple sets of alignment parameters, wherein the alignment parameters comprise alignment mark types, laser types and alignment mark position sets; randomly calling a group of corresponding relations in the corresponding relation table to form an alignmentscheme; executing an alignment operation according to the alignment scheme, if the execution time of the alignment operation exceeds a preset time, abandoning the currently executed alignment scheme,calling another group of corresponding relations in the corresponding relation table to form a new alignment scheme, and executing the alignment operation according to the new alignment scheme. The automation degree of alignment operation is improved, the probability of reworking is reduced, and the labor cost is reduced. The invention further provides an alignment system and a computer readable storage medium.

Description

technical field [0001] The present invention relates to the field of semiconductors, in particular to an alignment method, an alignment system and a computer-readable storage medium. Background technique [0002] Photolithography is a critical process in the manufacture of integrated circuits. The photolithography process refers to the process of transferring the pattern on the mask to the wafer with the help of photoresist under the action of light. The general photolithography process has to go through the processes of wafer surface cleaning and drying, primer coating, photoresist spin coating, soft baking, alignment, exposure, post-baking, development, hard baking, etching and testing. Wherein, the alignment refers to the alignment of the mask and the wafer, so as to ensure accurate registration between patterns after exposure. Therefore, alignment plays a crucial role in the accuracy of pattern transfer. [0003] Generally, an alignment system performs alignment throu...

AI Technical Summary

Problems solved by technology

However, in the above process, as long as an error occurs in a certain link, the alignment system may report an error and reject the wafer from the alignment system, and may continue to run until the technician finds out

Although technicians will propose multiple alignment schemes and find a better alignment scheme through testing before running, it is still difficult to avoid errors

For example, when the alignment mark on the wafer is damaged, the alignment mark cannot be used to align the wafer and the mask, and the wafer can only be replaced or the damaged wafer can be repaired after the wafer is withdrawn from the alignment system

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