A kind of light-moisture curing composition and preparation method thereof

A moisture-curing, composition technology, applied in the direction of non-polymer organic compound adhesives, polyether adhesives, adhesive types, etc., can solve the deformation of rigid and thin materials, high viscosity, and increased volume shrinkage and other problems, to achieve the effect of small shrinkage stress and low viscosity

Active Publication Date: 2022-03-18
深圳市中源鸿福科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing reaction time of UV curing adhesives is very short, which makes the volume shrinkage rate more obvious after curing.
Especially for glass cutting materials with low transparency or complex geometric surfaces, UV light cannot be irradiated effectively, so that UV-curable adhesives cannot be cured completely
[0003] Yantai Debon Advanced Silicon Material Co., Ltd. Chen Wei's invention patent, a UV / moisture dual-curing silicone water (patent application number 201410414947.7), which is polymerized by 97-98% silicone containing terminal double bonds and epoxy groups Composed of compound and 2-3% photoinitiator, it can be cured under ultraviolet light and moisture, and has strong bonding performance, but the silicone polymer containing terminal double bonds and epoxy groups has a higher viscosity, 3000 ~4000 mPas, so the internal stress caused by curing shrinkage will cause some rigid thin materials to deform or even crack, which will seriously affect the quality of the product and even lead to product scrap
And the bonded glass is difficult to fall off in hot water, so it is not suitable for the bonding of optical glass with low transparency or complex geometric curved surface cutting process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The raw materials and proportions (parts by weight) of the light-moisture curing composition are as follows:

[0027] 20 parts by weight of hydroxyl silicone oil

[0028] 20 parts by weight of polyethylene glycol (200) diacrylate

[0029] 10 parts by weight of hydroxypropyl acrylate

[0030] 15 parts by weight of isobornyl acrylate

[0031] CH 2 =CHCOO(CH 2 CH 2 O) 5 CH 2 Si(OCH 3 ) 3 3 parts by weight

[0032] 1 part by weight of 2-hydroxy-2-methyl-1-phenylacetone (1173)

[0033] 0.5 parts by weight of dibutyltin dilaurate

[0034] Hydroquinone 0.5 parts by weight

[0035] The above-mentioned components are sequentially added into the reaction kettle according to the amount, and the light-moisture curing composition is obtained after stirring evenly.

Embodiment 2

[0037] The raw materials and proportions (parts by weight) of the light-moisture curing composition are as follows:

[0038] 50 parts by weight of hydroxyl silicone oil

[0039] 30 parts by weight of polyethylene glycol (400) diacrylate

[0040] 20 parts by weight of hydroxyethyl acrylate

[0041] 20 parts by weight of isobornyl acrylate

[0042] CH 2 =CHCOO(CH 2 CH 2 O) 2 CH 2 Si(OCH 3 ) 3 5 parts by weight

[0043] 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone (184)

[0044] 1 part by weight of stannous octoate

[0045] 2 parts by weight of p-methoxyphenol.

[0046] The above-mentioned components are sequentially added into the reaction kettle according to the amount, and the light-moisture curing composition is obtained after stirring evenly.

Embodiment 3

[0048] The raw materials and proportions (parts by weight) of the light-moisture curing composition are as follows:

[0049] Hydroxyl silicone oil 25 parts by weight

[0050] 22 parts by weight of polyethylene glycol (600) diacrylate

[0051] 17 parts by weight of hydroxypropyl acrylate

[0052] 17 parts by weight of isobornyl acrylate

[0053] CH 2 =CHCOO(CH 2 CH 2 O) 3 CH 2 Si(OCH 3 ) 3 4 parts by weight

[0054] 2-Methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1 acetone (907) 1.5 parts by weight

[0055] 0.8 parts by weight of dibutyltin diacetyl

[0056] Hydroquinone 1.3 parts by weight

[0057] The above-mentioned components are sequentially added into the reaction kettle according to the amount, and the light-moisture curing composition is obtained after stirring evenly.

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PUM

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Abstract

The invention discloses a light-moisture curing composition, and its raw materials and proportions are as follows: 20-50 parts by weight of hydroxyl silicone oil; 20-30 parts by weight of polyethylene glycol acrylate; 10-20 parts by weight of hydroxyacrylate Parts by weight: 15-20 parts by weight of isobornyl acrylate; 3-5 parts by weight of water-soluble crosslinking agent; 1-2 parts by weight of free radical initiator; 0.5-1 parts by weight of organotin; 0.5-2 parts by weight of the polymerization inhibitor. The light-moisture curing composition of the present invention is cured by using low-viscosity hydroxyl silicone oil, water-soluble crosslinking agent and ultraviolet light-moisture. The obtained light-moisture curing composition is suitable for glass with low transparency or complex geometric curves Bonding of cutting materials, and has the characteristics of low viscosity, small shrinkage stress, proper bonding strength and easy degumming in hot water.

Description

technical field [0001] The invention belongs to the technical field of glass processing materials, in particular to a light-moisture curing composition and a preparation method thereof. Background technique [0002] The curing process of UV curing adhesive materials has the characteristics of energy saving, environmental protection, solvent-free, and fast curing, and is widely used in glass cutting processing. However, the curing reaction time of UV-curable adhesives is very short, which makes the volume shrinkage rate more obvious after curing. Especially for glass cutting materials with low transparency or complex geometric surfaces, UV light cannot be effectively irradiated, so that the UV-curable adhesive cannot be cured completely. [0003] Yantai Debon Advanced Silicon Material Co., Ltd. Chen Wei's invention patent, a UV / moisture dual-curing silicone water (patent application number 201410414947.7), which is polymerized by 97-98% silicone containing terminal double bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J4/06C09J183/04C09J171/02C09J11/06C08F283/12C08F222/20C08F220/28C08F220/18C08F230/08C08F290/06C08F2/48
CPCC09J4/06C09J183/04C09J11/06C08F283/122C08F290/062C08L71/02C08K5/00C08K5/5425C08K5/378C08K5/57C08K5/13C08K5/07C08F2/48
Inventor 聂秋林
Owner 深圳市中源鸿福科技有限公司
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