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A chip-type precision thin-film exclusion and its manufacturing method

A manufacturing method and precise technology, applied in the direction of resistance manufacturing, thin-film resistors, and resistors manufactured by photolithography, etc., can solve the problem that the inner wall of the through-hole of the exclusion substrate cannot be effectively covered

Active Publication Date: 2022-04-22
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a chip-type precision thin-film exclusion and its manufacturing method to solve the technical problem that the film sticking method cannot effectively cover the inner wall of the through-hole of the exclusion substrate, thereby forming a thin-film sputtering mask shielding layer through a soaking process, and then Realize that the dry glue completely covers the entire exclusion substrate and improves the resistance quality

Method used

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  • A chip-type precision thin-film exclusion and its manufacturing method
  • A chip-type precision thin-film exclusion and its manufacturing method
  • A chip-type precision thin-film exclusion and its manufacturing method

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Embodiment

[0064] Please refer to Figure 7-Figure 8 , The specification model is 4R03, the target resistance is 10KΩ, the resistance precision control: ±0.5%, TCR: ±25ppm / ℃; it adopts alumina ceramic substrate.

[0065] The production process is as follows:

[0066] Step 1: Print the back and surface electrodes by printing, and form the electrode layer after sintering.

[0067] Step 2: Soak dry glue:

[0068] ① Put the product into the photoresist (phenolic resin) liquid, the thickness of the liquid film is 1.0 μm to 4.5 μm, the product moves up and down during soaking, so that the colloid completely covers the product holes, and the soaking time is 10 to 15 minutes.

[0069] ② After the colloid is covered, put the product in a drying oven and dry it at 100-150°C for 10 minutes. Obtain solid dry glue.

[0070] ③. Expose and develop the mask pattern, and after sputtering, remove the mask layer with a release agent to expose the resistor.

[0071] Step 3: Laser adjustment of resistan...

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Abstract

The invention discloses a method for manufacturing a sheet-type precision thin film exclusion, comprising: S1, printing a back electrode and a surface electrode on the front and back of a substrate, respectively, so as to form an electrode layer after sintering; S2, making a dry glue through a soaking process , to expose and develop a mask pattern, remove the mask after sputtering to obtain a resistor body; the dry glue completely covers the entire exclusion substrate; S3, modify the resistance value through laser adjustment; S4, realize reinforcement through printing resin protection Protective layer; S5, marking printing, printing marking paste on the protective surface, and then curing at high temperature; S6, folding strips, dividing the product substrate from blocks into strips; S7, side sealing, using silver coating process to complete the back , surface electrodes are connected to form end-face electrodes; S8, folded particles, divide the product from strips into granules; S9, electroplating, electroplate the granulated products; the present invention forms a thin film sputtering mask shielding layer through the soaking process to realize Chip exclusion resistor film is thinned to improve resistor quality.

Description

technical field [0001] The invention relates to the field of electronic component manufacturing, in particular to a chip-type precision thin film exclusion and a manufacturing method thereof. Background technique [0002] At this stage, chip exclusion is mostly thick film exclusion, and some use thin film exclusion, but thick film resistors have poor stability, while thin film resistors have higher precision and better stability, and are used in precision equipment; however, at this stage Thin-film exclusion components have a high demand for photolithography masks, and dry film lamination should be made according to the electrode and resistor margins. It is difficult to obtain a comprehensive sputtering pattern with ordinary film-attaching processes, and the through holes in the exclusion substrate are also difficult to obtain. Difficult to completely cover with film. Due to the design of the through-hole in the exclusion substrate, the thin-film sputtering mask shielding l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C17/00H01C17/12H01C17/242H01C17/28
CPCH01C17/12H01C17/281H01C17/242H01C17/003H01C7/006
Inventor 杨泽明麦俊杨理强林瑞芬莫雪琼杨晓平
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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