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Electronic device package containing expanded flow component

An electronic device and dilatancy technology, applied in the field of electronic device packages containing dilatant components, can solve the problems of equipment damage, limited shock absorption and protection performance, etc.

Pending Publication Date: 2020-05-15
厦门天策材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when this material is used in human body protection or precision instrument protection, the main disadvantage is that the shock absorption and protection performance is limited. When impacted, ordinary protective materials cannot effectively dissipate the impact energy or feed it back In terms of energy changes, a slightly larger impact energy will exceed the maximum load of the energy-absorbing material, so there will still be a strong impact force on the electronic device, resulting in equipment damage

Method used

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  • Electronic device package containing expanded flow component
  • Electronic device package containing expanded flow component
  • Electronic device package containing expanded flow component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[2138] According to a preferred embodiment of the present invention, the electronic device package containing a dilatant component at least contains at least one dilatant component with a solid structure, and the dilatant component with a solid structure has a non-cellular structure ; The dilatant component is located in any suitable position of the electronic device package; The dilatant component contains an intrinsic dilatant polymer.

[2139] According to another preferred embodiment of the present invention, the electronic device package containing a dilatant component at least contains at least one dilatant component with a solid structure, and the dilatant component with a solid structure has a non-cellular structure; the dilatant component is located at any suitable position in the electronic device package; the dilatant component contains an extrinsic dilatant polymer.

[2140] According to another preferred embodiment of the present invention, the electronic device p...

Embodiment 1

[2301] The electronic device package made in this embodiment is as attached to the instruction manual. figure 1 As shown, it is a laptop bag, the surface layer of its four corners (as shown in the attached manual) figure 1 13 and 15) among them are dilatant components, and the dilatant component used is a solid structure, and its specific preparation method is as follows:

[2302] Get 0.75 molar equivalent polytetrahydrofuran diol (molecular weight is 500Da), 0.25 molar equivalent polytetrahydrofuran diol (molecular weight is 1000 Da), 0.25 molar equivalent polytetrahydrofuran diol (molecular weight is 1500Da), 0.75 molar equivalent polytetrahydrofuran dicarboxylic acid ( The molecular weight is 2000 Da), placed in a reaction vessel, dissolved with an appropriate amount of chloroform, then added 2 molar equivalents of 4-dimethylaminopyridine, 8 molar equivalents of dicyclohexylcarbodiimide, then stirred at room temperature for 24h, and then Add a chloroform solution with 0.2 ...

Embodiment 2

[2305] The electronic device package made in this embodiment is as attached to the instruction manual. figure 1 As shown, it is a laptop bag, the position inside the hand strap (as shown in the instruction manual figure 1 11) is a dilatant component, and the dilatant component used is a solid cell structure (a dilatant polymer whose filling volume ratio is 100% in the cyst), and its specific preparation method is as follows:

[2306]Take 1 molar equivalent of ethyl hydrogen-containing silicone oil and 2 molar equivalents of dimethyldivinylsilane, put them in a reaction vessel, dissolve them with an appropriate amount of toluene, and then add a small amount of platinum(0)-1,3-diethylene-1,1 , xylene solution of 3,3-tetramethyldisiloxane complex (the content of platinum is 0.003wt%), under argon atmosphere, stirred and reacted at 60°C for 48h, after the reaction was completed, impurities and solvent were removed to obtain a purified product The resulting purified product was sw...

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Abstract

The invention discloses an electronic device package containing an expanded flow component, which is characterized in that the electronic device package at least comprises at least one expanded flow component, and the expanded flow component is positioned at any proper position of the electronic device package. The electronic device package disclosed by the invention has extremely wide applicationin the fields of life, production, study, sports, leisure, entertainment, military affairs, police affairs, security, medical care and the like.

Description

technical field [0001] The invention relates to an electronic device package, in particular to an electronic device package containing a dilatant component. Background technique [0002] With the development and progress of science and technology, various electronic technology products are gradually coming out, and the use coverage of mobile phones, tablet computers, notebook computers and other electronic devices is becoming wider and wider. In the process of using and carrying these electronic devices, they will inevitably be damaged by different degrees of impact, drop, collision, etc., and the electronic device itself is a relatively sophisticated product, which is easily damaged by external forces and causes losses. Electronics packages currently on the market rely primarily on common elastomeric foams or relatively soft compressible materials as protective materials. However, when this material is used in human body protection or precision instrument protection, the m...

Claims

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Application Information

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IPC IPC(8): A45C11/00C08G83/00C08J3/24C08J9/14C08L23/08C08L91/06C08K13/02C08K3/22C08K5/3492C08K5/09C08L75/08C08K13/04C08K7/14C08K3/34C08K7/28C08J9/10C08L33/10C08J9/12C08L83/04C08L7/00C08L51/04C08L75/04C08L23/28C08L25/18
CPCA45C11/00C08G83/008C08J3/24C08J9/141C08J9/0061C08J9/0095C08J9/0066C08J9/0028C08J9/0023C08J9/145C08J9/0085C08J9/103C08J9/122C08J2203/14C08J2323/08C08J2491/06C08J2203/142C08J2375/08C08J2203/04C08J2333/10C08J2203/06C08J2383/04C08J2407/00C08J2351/04C08J2475/04C08J2323/28C08J2325/18A45C2011/002A45C2011/003
Inventor 不公告发明人
Owner 厦门天策材料科技有限公司
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