Device for cutting pi screen plate through laser imaging method and method thereof

Abstract

The invention relates to a device for cutting a pi screen plate through a laser imaging method and a method thereof. The device for cutting the pi screen plate comprises a tool bearing platform for clamping the screen plate, and an ultraviolet ultrashort pulse laser device; an output light path of the ultraviolet ultrashort pulse laser device is sequentially provided with a beam expander, a beam splitter unit, a photomask plate and a reflecting mirror set; a reflecting light path of the reflecting mirror set is connected with a galvanometer, the output end of the galvanometer is provided witha scanning field mirror, and the projection end of the scanning field mirror right faces the tool bearing platform. Ultrashort pulse ultraviolet laser is adopted, two pieces of light splitters are used for light splitting and dodging, laser forms an image on the surface of pi through the photomask plate, the pi and a glue layer are removed, imaging light spots are subjected to dodging treatment, and the taper of the cutting surface of the pi is remarkably decreased; and meanwhile, a plurality of imaging photomask plates different in size are arranged, thus, machining light spots are optional in size, galvanometer scanning is combined with platform linear movement so that material machining can be conducted, and the machining precision and efficiency are remarkably improved.

Description

technical field [0001] The invention relates to a device and a method for cutting a pi net plate by a laser imaging method. Background technique [0002] At present, with the continuous development of silicon solar cell technology, while pursuing low cost, the industry has higher and higher requirements for the performance of solar cells. Solar cell production mainly includes the following steps: silicon wafer cutting, material preparation; removal of damaged layer; texturing; diffusion junction; edge etching and cleaning; deposition of anti-reflection layer; slice test. Among them, the printing of electrodes has a great influence on the performance of the battery. High-quality electrodes can effectively improve the conversion efficiency of solar cells to a certain extent. The traditional positive electrode printing screen is composed of several busbars and several thin grids perpendicular to each other. The electrode busbars printed by this traditional screen are wide and...

AI Technical Summary

Problems solved by technology

People in the industry have been working on reducing the width of the printed fine grid lines, thereby increasing the effective illumination area of ​​the cell, but it is difficult to further improve the current collection capacity of the inherent grid line structure of the printed electrodes;

[0003] At present, the traditional laser processing method is to scan the Gaussian spot with a vibrating mirror to splice and fill the wire grid. The problem with this method is that the taper is too large for the processing of the thin wire grid; Filling processing is required, and the efficiency is extremely low; for long wire grid processing, the problem is that splicing processing is required, and there are obvious splicing traces, which will affect the electrical performance in the later stage

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