Pyrolysis adhesive film and production coating process thereof

Abstract

The invention discloses a pyrolytic adhesive film and a production coating process thereof, wherein the pyrolytic adhesive film at least comprises a release layer, a base material layer and a pressure-sensitive adhesive layer, wherein the release layer is a single-sided release film material and is used for winding the base material layer coated with the pressure-sensitive adhesive layer; and thepressure-sensitive adhesive layer is formed on the surface of the base material layer. The pyrolytic mucous membrane product is high in initial stripping force, a good fixing effect can be achieved onthe product, no residual adhesive is generated under high-temperature debonding, and stripping is easy. And meanwhile, the requirement on the debonding temperature does not influence the product.

Description

technical field [0001] The invention relates to a pyrolyzed mucous film and its production and coating process, in particular to a pyrolyzed mucous film without white mist and residue under high temperature and its production and coating process. Background technique [0002] In the production process of electronic products, the protective film is indispensable. The main function of the protective film is to protect the surface of the product. However, in the face of changing conditions and applications in the process, the requirements for the use of the protective film are becoming more and more stringent. The most common requirement is high temperature protection without leaving any glue residue. In the manufacturing process of electronic products, there are many stages that need to be baked or irradiated at high temperature to make the chemical objects remaining on the surface after surface treatment or erosion molding. Volatilization, and the protective film involved in ...

AI Technical Summary

Problems solved by technology

[0002] In the production process of electronic products, the protective film is indispensable. The main function of the protective film is to protect the surface of the product. However, in the face of changing conditions and applications in the process, the requirements for the use of the protective film are becoming more and more stringent. The most common requirement is high temperature protection without leaving any glue residue. In the manufacturing process of electronic products, there are many stages that need to be baked or irradiated at high temperature to make the chemical objects remaining on the surface after surface treatment or erosion molding. Volatilization, and the protective film involved in it as surface protection must also go through the same process and leave no residual glue on the pasted product when it is finally uncovered, but the traditional protective film, the colloid is mainly pressure-sensitive adhesive , is sensitive to high temperature. When the pressure-sensitive adhesive encounters high temperature, the molecular chain begins to loosen and the adhesive layer begins to soften and decompose. Therefore, it is easy to cause abnormal residual adhesive when it is peeled off. This is why most pressure-sensitive adhesive protective films will clearly require customers to Use at room temperature to minimize the risk. The structure of the traditional pressure-sensitive adhesive protective film is simple. / -2℃

However, in the face of different applications and requirements in the manufacturing process of electronic products, it may be necessary to withstand high temperatures up to 180 ° C, and the high temperature resistance time ranges from a few seconds to 30 minutes. Under the high temperature test, the molecular chain of the pressure sensitive adhesive is destroyed and loosened. Combined with other factors, it is the key to directly cause the risk of pressure-sensitive adhesive residual adhesive or the amount of residual adhesive: (1) Adhesive force, low adhesive force and small bite force of the surface to be pasted, the risk of residual glue is low, high adhesive force and the surface to be pasted The occlusal force is relatively large, and the force when peeling off is relatively large, so the risk of residual glue will be high; (2) the adhesive area, the overall occlusal force will be small if the adhesive area is small, and the risk of residual adhesive when peeling off is low; The overall bite force will be larger if the area is large, and the force when lifted is relatively large, so the risk of residual glue will be high

[0003] The current thermal debonding protective film in the market is prone to white fog and residual glue under high temperature conditions, and the debonding temperature is too high, which affects the fixed products.