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Electroplating liquid for electroplating pure cobalt and application thereof

A technology of electroplating solution and solution, which is applied in the field of applied electrochemistry to achieve the effect of electrical interconnection

Active Publication Date: 2020-04-21
苏州清飙科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the non-negligible electromigration of copper, and as the size of the interconnection becomes smaller and smaller, the problem becomes more and more prominent, and it is urgent to develop materials that replace electroplated copper for interconnection

Method used

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  • Electroplating liquid for electroplating pure cobalt and application thereof
  • Electroplating liquid for electroplating pure cobalt and application thereof
  • Electroplating liquid for electroplating pure cobalt and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Each component, content, and pH value of the electroplating solution for electroplating pure cobalt are as follows:

[0060] Base solution: CoSO 4 .7H 2 O, 80g / L

[0061] CoCl2 .6H 2 O, 10g / L

[0062] Boric acid: H 3 BO 3 ,20g / L

[0063] pH value: pH=4

[0064] Wetting agent: sodium dodecyl sulfate (SDS), 1.0g / L

[0065] Brightener: sodium saccharin, 1.0g / L

[0066] Accelerator: 2-mercaptobenzimidazole-5-sulfonate sodium dihydrate (MBIS), 0.050g / L

[0067] Complexing agent: dimethylglyoxime (DMG), 20000ppm.

[0068] Specifically, first weigh the CoSO 4 .7H 2 O, CoCl 2 .6H 2 O was added to water, stirred, and after being fully dissolved, boric acid was added. Thereafter, gradually add wetting agent, brightener, accelerator, and complexing agent, stir well, and adjust the pH to 4 with sulfuric acid and sodium hydroxide to obtain an electroplating solution for electroplating pure cobalt.

[0069] In order to evaluate the effect of using the electroplating s...

Embodiment 2

[0072] Each component, content, and pH value of the electroplating solution for electroplating pure cobalt are as follows:

[0073] Base solution: CoSO 4 .7H 2 O, 60g / L

[0074] CoCl 2 .6H 2 O, 10g / L

[0075] Boric acid: H3BO3, 30g / L

[0076] pH value: pH=5

[0077] Wetting agent: SDS, 1.2g / L

[0078] Brightener: sodium saccharin, 0.8g / L

[0079] Accelerator: MBIS, 0.030g / L

[0080] Complexing agent: cyclohexanone oxime (CHO), 1000ppm

[0081] Its specific preparation method is the same as in Example 1, and its description is omitted here.

[0082] In order to evaluate the effect of using the electroplating solution for electroplating pure cobalt of the present invention, samples with through-silicon vias (TSVs) were electroplated using it. Specifically, the sample was rinsed, vacuumed, and then the sample was figure 1 The schematic diagram of the device shown is installed in the electroplating tank, and the pure nitrogen gas stirring is turned on. The nitrogen gas...

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PUM

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Abstract

The present invention provides an electroplating liquid for electroplating pure cobalt and application thereof. The electroplating liquid for electroplating pure cobalt comprises: a base solution which is an aqueous solution of a soluble cobalt salt; and a complexing agent, wherein the complexing agent contains a conjugated oxime group. According to the electroplating liquid for electroplating pure cobalt, the strong cathodic polarization effect on cobalt ion electrochemical deposition is achieved due to the use of the complexing agent of the conjugated oxime group, the deposition rate of thecobalt can be controlled, the cobalt can evenly nucleate and grow, a high-quality pure cobalt plating layer is obtained and thus electrical interconnection is achieved.

Description

technical field [0001] The invention relates to the technical field of applied electrochemistry, in particular to an electroplating solution for electroplating pure cobalt and its application. Background technique [0002] For electronic devices, the desire to reduce size while increasing performance has driven the development of interconnection processes toward smaller feature sizes of interconnects, so more components can be integrated in a more limited electronic field. As the feature size shrinks, more and more problems are caused, such as electromigration, interdiffusion, etc. [0003] At present, the interconnection is mainly realized by electroplating copper. However, due to the non-negligible electromigration of copper, and as the interconnect size becomes smaller and smaller, the problem becomes more and more prominent, and it is urgent to develop materials that can replace electroplated copper for interconnection. Contents of the invention [0004] In view of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D5/02H01L21/768
CPCC25D3/12C25D5/02H01L21/76879H01L21/76898
Inventor 胡斌
Owner 苏州清飙科技有限公司
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