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Chemical palladium solution applied to chemical gold palladium gold plating on pcb

A chemical gold and coating technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems that are difficult to deal with fine and complex electronic circuit design products, and achieve excellent ductility and stable coordination system , better bending resistance

Active Publication Date: 2021-10-08
深圳市溢诚电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing surface treatment methods such as spray tin, tin, silver, and OSP are mainly used for solder connection processes. The main disadvantage is that they can only be applied to the most basic circuit design and electronic products, because the solder itself limitations, it is difficult to deal with fine and complex electronic circuit design products

Method used

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  • Chemical palladium solution applied to chemical gold palladium gold plating on pcb
  • Chemical palladium solution applied to chemical gold palladium gold plating on pcb
  • Chemical palladium solution applied to chemical gold palladium gold plating on pcb

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Palladium sulfate (as Pd 2+ total): 0.3g / L, ethylenediamine: 5g / L, 4-fluorobenzylamine: 2g / L, hydroxylamine sulfate: 3g / L, 7-(diethylamino)coumarin: 15mg / L, glycine: 5g / L, ammonium sulfate: 8g / L, tetrabutylammonium bisulfate: 2mg / L temperature: 60°C, pH7.5.

[0076] The appearance of the palladium layer obtained under the above parameters is flat and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 4.3μinch (plating for 15 minutes). The stability of the solution reaches 6MTO (the circular experiment of palladium plating on the copper substrate is carried out. In the case of the plating solution with a palladium concentration of 0.3g / L in the construction of the tank, it is called 1MTO to deposit 0.3g / L palladium on the substrate), 3M Adhesive force of adhesive tape coating is good. At the same time, after the bending resista...

Embodiment 2

[0078] Palladium Ammonium Sulfate (as Pd 2+ Total): 0.6g / L, ethylenediamine: 10g / L, benzylamine: 1g / L, N,N-diethylhydroxylamine: 10g / L, 7-(diethylamino)coumarin: 50mg / L , Glycine: 1g / L, Ammonium Sulfate: 4g / L, Tetrabutylammonium Bisulfate: 0.1mg / L Temperature: 40°C, pH 7.0

[0079] The appearance of the palladium layer obtained under the above parameters is flat and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 3.2μinch (plating for 10 minutes). Liquid stability up to 6MTO, 3M adhesive tape coating has good adhesion. At the same time, after the bending resistance test of the coating, no obvious cracks were observed at 100 times magnification; the solder test showed that the pads were well wetted and the tin was full; the bonding performance was excellent, and the gold wire tensile test reached more than 10g.

Embodiment 3

[0081] Palladium Ammonium Sulfate (as Pd 2+ Total): 0.4g / L, furfurylamine: 5g / L, benzylamine: 10g / L, D-mannitol: 2g / L, thiodiglycolic acid: 100mg / L, glycine: 3g / L, ammonium sulfate : 15g / L, cetyltrimethylammonium bisulfate: 5mg / L Temperature: 50℃, pH 7.2

[0082] The appearance of the palladium layer obtained under the above parameters is smooth and bright, there is no penetration plating on the fine lines, there is no missing plating in the micro and blind holes, and the lines are not whitish or falling off. The thickness of the coating is 4.6μinch (plating for 15 minutes). Liquid stability reaches 5.5MTO, 3M adhesive tape coating has good adhesion. At the same time, after the bending resistance of the coating, no obvious cracks were observed when magnified 100 times; the solder test showed that the pads were well wetted and the tin was full; the bonding performance was excellent, and the gold wire tensile test reached more than 10g.

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Abstract

The invention discloses a chemical palladium solution applied to chemical gold-palladium-gold plating on PCB, including main salt, complexing agent, reducing agent, stabilizer, pH buffering agent and surface active agent, with mass concentration as unit, the above-mentioned composition The ratio of points is: palladium concentration in the main salt: 0.4-0.6g / L; complexing agent: 0.1-30g / L; reducing agent: 0.1-25g / L; stabilizer: 1-150mg / L; pH buffer : 1‑25g / L; Surfactant: 0.1‑10mg / L; The remaining components are pure water. The palladium layer prepared by the palladium solution can meet good welding and bonding requirements, and is also suitable for surface treatment of lines with a line width / space below 0.5mil / 0.5mil or even smaller.

Description

technical field [0001] The invention relates to the technical field of PCBs, in particular to a chemical palladium solution applied to chemical gold-palladium-gold plating on PCBs. Background technique [0002] COF is an IC packaging technology. It uses the flexible substrate circuit FPC as the carrier of the packaged chip. ) for bonding (Bonding) technology. After the COF production is completed, after the LCD Panel module factory obtains the IC, the IC on the tape will be cut into single pieces by punching (Punch) equipment. Usually, there will be design input on the flexible substrate circuit of COF The outer pins (Outer Lead) at both ends of the input terminal (Input) and the output terminal (Output). PCB) bonding. [0003] In the smart portable era, the rapid development of small electronic products represented by mobile phones, computers and monitors. The COF FPC substrate adopts the SAP semi-additive production method which is completely different from the standar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44H05K3/18
CPCC23C18/44H05K3/181
Inventor 卢意鹏许国军吴运会许香林刘高飞
Owner 深圳市溢诚电子科技有限公司
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