Leveling mounting frame and wafer bearing device

Abstract

The invention belongs to the field of precision grinding equipment, and particularly relates to a leveling mounting frame and a wafer bearing device. The leveling mounting frame comprises a supportingframe and a machine frame which are oppositely arranged as well as at least two sets of adjusting mechanisms; a mounting position is arranged on the supporting frame; each adjusting mechanism comprises an adjusting rod, wherein a first threaded section and a second threaded section are arranged on the outer surface of each adjusting rod, and the first threaded sections and the second threaded sections are differential threads with the same spiral line direction; and adjusting holes corresponding in position are formed in the supporting frame and the machine frame correspondingly, the first threaded sections of the adjusting rods of each set of adjusting mechanisms are in threaded connection with threaded holes in the supporting frame, and the second threaded sections of the adjusting rodsof each set of adjusting mechanisms are in threaded connection with threaded holes in the machine frame. Besides the above leveling mounting frame, the wafer bearing device further comprises a waferbearing platform arranged on the mounting position of the supporting frame. According to the leveling mounting frame and the wafer bearing device, high-precision adjustment of a bearing object can beachieved, the influence of equipment vibration on the adjusted angle is small, and therefore the yield and the machining efficiency can be guaranteed.

Description

technical field [0001] The application belongs to the field of precision grinding equipment, and in particular relates to a leveling mounting frame and a chip bearing device. Background technique [0002] Ultra-precision grinding technology has the advantages of high processing efficiency, high processing quality, and easy automation of the processing process. It has become one of the key technologies for ultra-precision processing of silicon wafers in IC (Integrated Circuit) manufacturing. In the preparation stage of the substrate silicon wafer, ultra-precision grinding is used for the planarization of the silicon wafer. With the rapid development of IC manufacturing technology, the development trend of large wafer diameter and ultra-thinning has put forward higher requirements for the processing efficiency and processing quality of wafer ultra-precision grinding. [0003] Wafer thinning machine is a special equipment for precise grinding of wafer surface, integrating grin...

AI Technical Summary

Problems solved by technology

During grinding, the wafer is placed on the wafer table, and then passes through the rough grinding spindle above the wafer table, and then the fine grinding spindle for grinding. The rigidity of the wafer table and the flatness of the surface are related to the TTV value of the surface of the wafer after thinning (Total thickness variation, Total thickness variation) is closely related. At present, the common angle adjustment structure of the wafer table has low precision and low reliability. When working for a long time, the angle after adjustment will also change with the vibration of the equipment. Directly reduce the TTV value after wafer grinding, thereby reducing yield and processing efficiency

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