Method for realizing full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes

Abstract

The invention discloses a method for realizing the full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes. The method comprises the following steps that: S1, the sequence code of an inner-layer core board is generated, transcoding is performed, a lattice code is generated, and code assignment is performed; S2, the association of the inner-layer core board with anouter-layer board and the sequence code production of the outer-layer board are performed, the inner-layer core board is associated with an outer-layer board, specifically, inner-layer core board tracing codes are identified and analyzed through a photoelectric analysis module in an overlapping and pre-arranging process, inner-layer core board ID sequence numbers are associated according to a product process, and a new outer-layer board ID sequence number is automatically generated according to groups; S3, the transcoding of the outer-layer board is performed, a dot matrix code is generated,and code assignment is performed; S4, tracing code reading is performed; and S5, a tracing system is established. Therefore, the association of the IDs of the inner-layer core board and the outer-layer core board is realized, and the full-process tracing of a PCB from the inner layer to the outer layer is realized.

Description

technical field [0001] The invention relates to the technical field of traceability of the whole process of PCB product manufacturing, in particular to a method for realizing traceability of the whole process of PCB product manufacturing based on hexadecimal dot matrix hole codes. Background technique [0002] With the development of the electronic circuit industry, the design and process of PCB products are becoming more and more complex, and the requirements for product manufacturing quality control are also constantly improving; manufacturing companies in the electronic circuit industry belong to high-end discrete manufacturing, with multi-variety, small batch, The characteristics of make-to-order production include the coexistence of production and research, mixed-line production, continuous changes in the process, and constant switching of main and auxiliary materials. It is necessary to quickly present the factor information of each process in the product manufacturing ...

AI Technical Summary

Problems solved by technology

[0007] 1. The outer layer board is formed by stacking multiple inner layer core boards by hot pressing. Due to the process requirements, the inner core board needs to be covered with PP film before lamination, so it is impossible to realize the ID of the inner layer core board and the outer layer board. association;

[0008] 2. At present, laser one-dimensional codes or two-dimensional codes are generally used in the form of ID coding of products and products in progress. However, due to the PCB's electroplating and etching process in product manufacturing, the codes are easily covered, polluted or even damaged, resulting in codes that cannot be coded. Recognition or low recognition rate;

[0009] 3. The one-dimensional code or two-dimensional code has more pixels, and the coding efficiency is relatively low, which seriously affects the manufacturing capacity;

[0010] 4. Since the product and WIP ID are only coded on the surface, only front lighting can be used for code code information collection, which is greatly affected by the lighting environment of the working condition, resulting in low recognition efficiency

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