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Method and equipment for curing phenolic aldehyde foam material

A phenolic foam material and equipment technology, applied in the field of phenolic resin, can solve problems such as cracking, inconsistent shrinkage, deformation, etc., and achieve the effects of accelerating chemical reactions, ensuring product quality, and uniform heat

Active Publication Date: 2013-01-23
JINAN SHENGQUAN GROUP SHARE HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The second technical problem to be solved by the present invention lies in the technical problem that the prior art tends to produce inconsistent shrinkage, deformation or cracking in the process of curing phenolic foam materials, thereby proposing a method and method for curing phenolic foam boards that are not prone to deformation or cracking equipment

Method used

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  • Method and equipment for curing phenolic aldehyde foam material
  • Method and equipment for curing phenolic aldehyde foam material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] (1) Ripening equipment

[0051] Such as figure 1 As shown, the curing equipment includes a conveyor 11, here is a conveyor belt, the input end 10 of the conveyor is used to input the phenolic foam material to be cured, and the output end 100 of the conveyor is used to output the cured phenolic foam material, a first microwave suppressor 2, a microwave radiation device 3, a second microwave suppressor 22 and a cooling device 8 are sequentially arranged between the input end 10 of the transmission device and the output end 100 of the transmission device, and the microwave radiation The device 3 is connected with the microwave control device 9, and the moisture discharge pipeline 4 is arranged above the microwave cabinet, and the moisture discharge pipeline 4 communicates with the interior of the microwave cabinet through the moisture discharge pipeline regulating valve 5, so that The opening degree of the regulating valve 5 of the dehumidification pipeline is 1 / 4, an exh...

Embodiment 2

[0057] (1) Ripening equipment

[0058] Adopt the same curing equipment as (1) in Embodiment 1, the difference is: the microwave radiation device 3 is a microwave box, there is no infrared hot air device between the input end 10 of the transmission device and the first microwave suppressor 2 .

[0059] (2) Aging process of phenolic foam material

[0060] Use the curing equipment in this embodiment (1) to ripen the phenolic foam insulation board, and the specific steps are: the phenolic foam insulation board enters the first microwave suppressor 2 from the input end 10 of the transmission device, and then enters the microwave box , microwave curing is carried out in the microwave box, after the microwave radiation is completed, the product enters the cooling device 8 for cooling treatment after passing through the second microwave suppressor 22, and the cooled product has been matured, output through the output terminal 100 of the transmission device, and enter The packaging s...

Embodiment 3

[0062] (1) Ripening equipment

[0063] The same curing equipment as (1) in Example 1 is used, the difference is that the microwave radiation device 3 is two microwave cabinets.

[0064] (2) Aging process of phenolic foam material

[0065] Use the curing equipment in this embodiment (1) to cure the phenolic foam insulation board, and the specific steps are the same as the method in embodiment 1 (2), the difference is: wherein, the temperature in the infrared hot air box is 80 ° C; Along the direction from the input end 10 to the output end 100, set the preset temperature of each microwave box to 60°C and 70°C in turn; the time to pass through the infrared hot air box is 30 minutes, and the phenolic foam insulation board needs to pass through each microwave box. The total time required to complete the entire curing process is 93 minutes.

[0066] Detect various indexes of the phenolic foam insulation board after curing in this embodiment, and the specific indexes are shown in ...

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Abstract

The invention discloses a method and equipment for curing a phenolic aldehyde foam material. The method for curing the phenolic aldehyde foam material comprises the steps of radiating the phenolic aldehyde foam material to be cured by using microwaves and cooling the phenolic aldehyde foam material. The equipment for curing the phenolic aldehyde foam material has the advantages that moisture, residual foaming agents and formaldehyde inside the phenolic aldehyde foam material are evaporated rapidly, and a chemical reaction inside the phenolic aldehyde foam material is greatly accelerated, so that the curing time is shortened. The microwaves are penetrable, so that the surface and inside of the phenolic aldehyde foam material are subjected to microwave radiation at the same time; and polar molecules absorb the energy of electromagnetic waves and generate uniform heat, so that the product quality is guaranteed, and the phenomenon that the phenolic aldehyde foam material shrinks discordantly, cracks or deforms is avoided.

Description

technical field [0001] The invention belongs to the field of phenolic resins, and in particular relates to a curing method and equipment for a phenolic foam material. Background technique [0002] Known as the "king of thermal insulation materials", phenolic foam is a new generation of thermal insulation, fireproof and sound insulation materials. Phenolic foam material is a polymer organic rigid foam product, which is foamed by thermosetting phenolic resin. It has the characteristics of light weight, fireproof, non-combustible in case of open flame, smokeless, non-toxic, non-dripping, wide range of operating temperature (-196°C to 200°C), non-shrinking and non-brittle in low temperature environment. Due to the high closed cell rate of phenolic foam, the thermal conductivity is low (can be lower than 0.030w / mk), the thermal insulation performance is good, and it has certain water resistance and water vapor permeability, so it is a good thermal insulation and energy-saving ma...

Claims

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Application Information

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IPC IPC(8): B29C71/04
Inventor 唐一林唐路林徐传伟王庆冀
Owner JINAN SHENGQUAN GROUP SHARE HLDG
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