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Optical transceiving module and packaging method thereof

A technology for optical transceiver modules and lasers, applied in the directions of light guides, optics, optical components, etc., can solve the problems of compressing the PCB design flexibility of printed circuit boards, increasing the complexity of module assembly, and occupying module design space, so as to facilitate the integration of wavelength division Multiple functions, compact overall structure of the module, and the effect of reducing the package size

Pending Publication Date: 2020-02-28
绍兴柯芯光电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, many optical transceiver modules on the market are in the form of TOSA and ROSA discrete packages, which occupy a large amount of limited design space in the module, compress the flexibility of printed circuit board PCB design, complicate the heat dissipation design, and increase the Assembly complexity

Method used

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  • Optical transceiving module and packaging method thereof
  • Optical transceiving module and packaging method thereof
  • Optical transceiving module and packaging method thereof

Examples

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Embodiment

[0040] Embodiment: an optical transceiver module and packaging method thereof, such as Figure 1-9 As shown, the optical transceiver module includes a fiber array (Fiber Array, referred to as FA) 1, a ceramic substrate 3, an iron sheet 4, heat dissipation silicon grease 12, a vertical cavity surface emitting laser 6, a surface receiving detector 5, a laser driver chip 8, and a span A resistance amplifier chip 7 and a printed circuit board (PCB for short) 10, wherein the surface of the printed circuit board 10 is provided with through grooves, and the printed circuit board 10 is placed in a metal casing.

[0041] Wherein, the optical fiber array 1 is supported on the ceramic substrate 3 , and the two are bonded by a low-shrinkage ultraviolet curing glue 14 . The ceramic substrate 3 is supported on the iron sheet 4 . The iron sheet 4 is located directly below the through groove of the printed circuit board 10 , and the iron sheet 4 and the printed circuit board 10 are bonded by...

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Abstract

The invention relates to an optical transceiving module and a packaging method thereof. The optical transceiving module comprises a printed circuit board, wherein a through groove is formed in the printed circuit board, an iron sheet is fixedly arranged below the through groove, a ceramic substrate is fixedly arranged on the upper surface of the iron sheet, a vertical cavity surface emitting laser, a surface receiving detector, a laser driving chip, a transimpedance amplification chip and an optical fiber array are attached to the surface of the ceramic substrate, and the ceramic substrate andall components installed on the surface of the ceramic substrate are covered and packaged by means of an epoxy resin black glue. The optical transceiving module has the advantages of low cost, high reliability, good heat dissipation performance, compact structure, high expandability and the like.

Description

technical field [0001] The invention relates to an optical transceiver module and a packaging method thereof, in particular to an integrated optical transceiver module, which belongs to the technical field of optical fiber communication. Background technique [0002] As one of the solutions for high-speed and large-capacity interconnection transmission, optical transceiver modules are widely used in wireless base stations, Ethernet networking, data centers, and emerging 5G transmission architectures in recent years. Its technology and cost have considerable advantages compared with the traditional signal transmission using copper wiring. Cables based on traditional copper wiring have disadvantages such as bulkiness, large bending radius, high power consumption, short transmission distance, and low rate. Compared with the optical transceiver module, the use of light for signal transmission has many advantages. For example, the transmission power on the link is lower, the wei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4239G02B6/4268G02B6/428G02B6/4286G02B6/4287G02B6/4296
Inventor 刘柳时尧成周璇
Owner 绍兴柯芯光电技术有限公司
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