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Ceramic copper clad laminate and its preparation process and application

A technology of ceramic copper clad laminate and preparation process, which is applied in the direction of chemical instruments and methods, coatings, metal layered products, etc., can solve the problems affecting the use of appearance products, large copper grains on the upper surface of ceramic copper clad laminates, etc., and achieve crystal The effect of small particles and high automatic recognition rate

Active Publication Date: 2021-04-20
BYD CO LTD
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Problems solved by technology

[0003] The existing ceramic copper-clad laminate preparation process generally includes two steps of copper sheet oxidation and copper sheet covering. Since the copper sheet is placed on the ceramic substrate during oxidation, the upper surface of the copper sheet is oxidized, but the lower surface is not oxidized. The copper grains on the upper surface of the copper clad laminate are relatively large, which affects the appearance and the use of subsequent products

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  • Ceramic copper clad laminate and its preparation process and application
  • Ceramic copper clad laminate and its preparation process and application
  • Ceramic copper clad laminate and its preparation process and application

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preparation example Construction

[0036] The present disclosure provides a preparation process of a ceramic copper clad laminate, the process comprising:

[0037] S1, forming a copper layer on the surface of the ceramic backing plate, and then performing a first thermal oxidation treatment on the surface of the copper layer to obtain an oxidized backing plate;

[0038] S2. Place the copper sheet on the copper layer of the oxidized backing plate after the first thermal oxidation treatment, perform the second thermal oxidation treatment on the oxidized backing plate and the copper sheet, and then separate the two to obtain the copper oxide sheet; The surface of the copper oxide sheet separated from the oxide backing plate is the first surface, and the surface of the copper oxide sheet opposite to the first surface is the second surface;

[0039] S3, bonding the second surface to the ceramic substrate, and then performing cladding treatment to obtain a ceramic copper clad laminate.

[0040] In the disclosed proc...

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Abstract

The present disclosure relates to a ceramic copper-clad laminate and its preparation process and application. The process includes: S1. Forming a copper layer on the surface of a ceramic backing plate, and then performing a first thermal oxidation treatment on the surface of the copper layer to obtain an oxidized backing plate; S2. Place the copper sheet on the copper layer of the oxidized backing plate after the first thermal oxidation treatment, perform the second thermal oxidation treatment on the oxidized backing plate and the copper sheet, and then separate the two to obtain the copper oxide sheet; The surface where the copper oxide sheet is separated from the oxide backing plate is the first surface, and the surface of the copper oxide sheet opposite to the first surface is the second surface; S3, attaching the second surface to the ceramic substrate, and then covering processing to obtain a ceramic copper clad laminate. The surface crystal grains of the copper sheet of the ceramic copper clad laminate of the present disclosure are small, and the automatic recognition rate is high.

Description

technical field [0001] The present disclosure relates to the technical field of ceramic copper-clad laminates, in particular, to a ceramic copper-clad laminate and its preparation process and application. Background technique [0002] Ceramic copper clad laminate (English full name: Direct Bonded Copper, English abbreviation DBC) refers to the product obtained by bonding the rolled copper sheet directly to the surface of the ceramic substrate at high temperature. Among them, the alumina ceramic substrate is used as the insulating substrate. Crystal-bonded copper sheets. Ceramic copper clad laminates not only have excellent electrical insulation properties, but also have high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like PCB boards, and have a large load capacity streaming capability. Therefore, ceramic copper-clad laminates have become the basic materials for high-power power electronic circuit structure techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/04B32B15/20B32B37/06B32B37/10
CPCB32B9/005B32B9/041B32B15/04B32B15/20B32B37/06B32B37/10B32B2255/205
Inventor 皮静武宋山青徐强吴波
Owner BYD CO LTD
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