Quantum dot light emitting diode and preparation method thereof
A quantum dot light-emitting and diode technology, which is applied in the manufacturing of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problem of low carrier injection efficiency, etc., to improve the carrier injection efficiency and carrier injection efficiency. , the effect of promoting electron injection
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[0024] On the other hand, the embodiment of the present invention also provides a method for preparing a quantum dot light-emitting diode, including the following steps:
[0025] preparing a first interface dipole layer for improving the work function of the anode on the anode or the quantum dot light-emitting layer; and / or
[0026] A second interface dipole layer for reducing the work function of the cathode is prepared on the cathode or the quantum dot light-emitting layer.
[0027] The preparation method of the quantum dot light-emitting diode provided by the embodiment of the present invention has a simple process. By preparing the first interface dipole layer that improves the work function of the anode and / or the second interface dipole layer that reduces the work function of the cathode, the final quantum dot The efficiency of carrier injection in light-emitting diodes is significantly improved, ultimately improving their light-emitting performance.
[0028] Specifical...
Embodiment 1
[0039] A quantum dot light-emitting diode, the preparation process of which is as follows:
[0040] Firstly, p-PFP-O was dissolved in a mixed solution of methanol and dimethyl sulfoxide with a mass ratio of 98:2 to prepare a mixed solution with a concentration of 0.02 wt%. PFNBr was then dissolved in methanol to prepare a solution with a concentration of 0.2 mg / mL.
[0041] A. Spin-coat a layer of p-PFP-O film on the ITO conductive glass as the first interface dipole layer;
[0042] B. Spin-coat a layer of TFB on the p-PFP-O layer;
[0043] C. Spin-coat a layer of CdSe / ZnS quantum dot luminescent layer on the TFB layer;
[0044] D. Spin-coat a ZnO electron transport layer on the CdSe / ZnS quantum dot light-emitting layer;
[0045] E. Spin-coat a layer of PFNBr film on the ZnO electron transport layer as the second interface dipole layer, and then anneal at 100°C for 30min;
[0046] F. Evaporating a layer of Al cathode layer on the PFNBr layer to obtain a quantum dot light-emi...
Embodiment 2
[0048] A quantum dot light-emitting diode, the preparation process of which is as follows:
[0049] First, p-PFP-O was dissolved in a mixed solution of methanol and dimethyl sulfoxide with a mass ratio of 99:1 to prepare a mixed solution with a concentration of 0.08wt%. PFNBr was then dissolved in methanol to prepare a solution with a concentration of 1 mg / mL.
[0050] A. Spin-coat a layer of PFNBr film on the ITO conductive glass as the first interface dipole layer, and then anneal at 100°C for 30min;
[0051] B. Spin-coat a layer of ZnO on the PFNBr layer;
[0052] C. Spin-coat a layer of CdSe / ZnS quantum dot luminescent layer on the ZnO layer;
[0053] D. Spin-coat a PVK layer on the CdSe / ZnS quantum dot luminescent layer;
[0054] E. Spin-coat a layer of p-PFP-O film on the PVK layer as the second interface dipole layer;
[0055] F. An Al cathode layer is vapor-deposited on the p-PFP-O layer to obtain a quantum dot light-emitting diode.
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