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Composite high-frequency substrate with characteristics of high Dk and low Df and preparation method thereof

A composite and characteristic technology, applied in the direction of circuit substrate materials, printed circuit components, electrical components, etc., can solve the problems that cannot really meet high frequency and high speed, cannot meet high Dk requirements, and is prone to high leakage current, etc., to achieve excellent Thermal stability, good electrical properties, good electrical properties

Pending Publication Date: 2020-01-07
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Adding metal powder in the next layer can get a high DK value of more than 45, but at the same time Df will also increase, which cannot really meet the needs of high frequency and high speed, and this kind of material is prone to high leakage current in practical applications behavior, greatly reducing its applicability
[0005] 2. Only pure high-content and high-dielectric ceramic powder is added to the epoxy resin, but the ceramic powder in the dispersed epoxy resin is due to the irregular dipole arrangement, so that the effect of electric dipole polarization will be offset. Thus the effect of increasing the dielectric constant value is quite limited
The previous patents are still only high-frequency substrate materials with Dk between 2.0-3.5, which cannot meet the needs of high Dk (Dk>8.0)

Method used

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  • Composite high-frequency substrate with characteristics of high Dk and low Df and preparation method thereof
  • Composite high-frequency substrate with characteristics of high Dk and low Df and preparation method thereof
  • Composite high-frequency substrate with characteristics of high Dk and low Df and preparation method thereof

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Experimental program
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Effect test

Embodiment approach

[0062] Embodiment: A composite high-frequency substrate with high Dk and low Df characteristics, such as Figure 1 to Figure 4 As shown, it includes a first copper foil layer 20 and a core layer 10. The core layer 10 includes several polymer film layers 101 and several dielectric adhesive layers, and the adjacent polymer film layers are laminated with the dielectric adhesive Together, the first copper foil layer is located on the surface of the outermost dielectric adhesive layer of the core layer, and the dielectric adhesive layer includes at least one of the first dielectric adhesive layer 102 and the second dielectric adhesive layer 103 One, the first dielectric adhesive layer refers to an adhesive layer with a Dk value of 6-30 (10G HZ) and a Df value of 0.002-0.020 (10G HZ), and the second dielectric adhesive layer refers to a Dk value of 15- 100 (10G HZ) and an adhesive layer with a Df value of 0.002-0.020 (10G HZ), and the Dk value of the second dielectric adhesive layer...

Embodiment approach 1

[0090] Embodiment 1: A composite high-frequency substrate with high Dk and low Df characteristics, such as figure 1 As shown, the high-frequency substrate is a single-sided adhesive copper-clad substrate, the dielectric adhesive layer is the first dielectric adhesive layer 102, and the core layer 10 is composed of several first dielectric adhesive layers 102 Composed of several polymer film layers 101, the first dielectric adhesive layer is spaced apart from the polymer film layer, and the first dielectric adhesive layer is located on the outermost side of the core layer .

[0091] The single-sided adhesive copper-clad substrate further includes a release layer 30, and the core layer is located between the first copper foil layer and the release layer.

Embodiment approach 2

[0092] Embodiment 2: A composite high-frequency substrate with high Dk and low Df characteristics, such as figure 2 As shown, the structure is similar to Embodiment 1, except that: the high-frequency substrate is a double-sided copper-clad substrate, and the double-sided copper-clad substrate also includes a second copper foil layer 40, and the core layer is located on the Between the first copper foil layer 20 and the second copper foil layer 40 .

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Abstract

The invention discloses a composite high-frequency substrate with the characteristics of high Dk and low Df. The high-frequency substrate comprises a first copper foil layer and a core layer; the corelayer comprises a plurality of high-molecular polymer film layers and a plurality of dielectric adhesive layers; the dielectric adhesive layer comprises at least one of a first dielectric adhesive layer and a second dielectric adhesive layer; the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than the Dk value of the first dielectric adhesive layer; andthe core layer refers to a core layer with a Dk value of 6-50 and a Df value of 0.002-0.020. The laser drilling technology is better, the inward shrinkage condition is not likely to happen, the hygroscopicity is low, the insulativity is high, the size stability is high, the thermal stability is excellent, and the high Dk and low Df electrical property is better; normal press fit parameters can beused for being matched with quick press equipment or pressure transmission equipment, the cost advantage is achieved, and the thick film manufacturing technology is achieved.

Description

technical field [0001] The invention relates to the field of FPC (flexible circuit board) and its preparation technology, in particular to a high-frequency high-transmission substrate and its preparation method, which are mainly used in the field of high-frequency and high-speed transmission FPC, such as automotive radar, global positioning satellite antenna, and cellular telecommunication systems , wireless communication antenna, data link cable system, direct broadcast satellite, power backplane, etc. Background technique [0002] With the rapid development of information technology, wireless communication has become a necessity of life. The wireless communication system is composed of transmitting, receiving and antenna. The antenna is responsible for the conversion of the electromagnetic energy value between the circuit and the air, and is an indispensable basic equipment for the communication system. In antenna-related circuit design, passive components such as capacit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03
CPCH05K1/0353
Inventor 李建辉林志铭杜伯贤李莺
Owner KUSN APLUS TEC CORP
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