Efficient chip cutting method

Abstract

The invention relates to an efficient chip cutting method, which comprises the following steps: cleaning the surface of a substrate, and fully pasting a double-sided UV film onto a cutting area; placing a to-be-cut chip on the substrate and fixing the to-be-cut chip in the cutting area through the double-sided UV film; placing the substrate on a workbench of a cutting machine, and cutting the to-be-cut chip along a cutting auxiliary line on the to-be-cut chip until the to-be-cut chip is completely cut off; taking the substrate down from the workbench of the cutting machine, and cleaning and blow-drying the substrate; illuminating the substrate to make the double-sided UV film lose viscosity, and taking down single chips after cutting one by one. Because the double-sided UV film is arrangedon the substrate, the to-be-cut chip can be fixed on the substrate, and it is ensured that the position of the chip is relatively fixed during cutting. After cutting is completed, the double-sided UVfilm loses viscosity through illumination, and single chips are directly taken down and do not need to be cleaned through a chemical solvent. Therefore, the period of the cutting process is shortened, the cutting efficiency is improved, and the cutting precision and the cutting quality can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of chip dicing, in particular to a high-efficiency chip dicing method. Background technique [0002] Since the beginning of this year, the three major domestic operators have increased their investment in access network construction, especially under the wave of large-scale construction of FTTx, they have carried out large-scale centralized procurement of optical distribution system equipment. Optical splitters are the core components of optical distribution system equipment, and the total purchase volume of the three operators has maintained rapid growth in recent years. [0003] With the strengthening of operators' centralized procurement and the increase in procurement volume, the prices of optical splitters and their components are bound to decrease gradually. Then, on the premise of ensuring the quality of this carrier-grade product, improving production efficiency is an important link that manufacture...

AI Technical Summary

Problems solved by technology

[0004] The traditional cutting method is to stick the chip on ordinary glass with paraffin wax for cutting, and use chemical solvent to clean it in ultrasonic wave after cutting. The cycle is long, this method is inefficient, and chemical solvent will also cause corrosion to the chip , affecting the quality, stability and service life of the chip

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