Formula of composite texturing additive for preparing maize-shaped monocrystal silicon textured surface as well as use method of additive
A technology of additives and single crystal silicon wafers, which is applied in the direction of single crystal growth, single crystal growth, chemical instruments and methods, etc., can solve the problems affecting the photoelectric conversion efficiency of solar cells and the effect of texturing on the surface of single crystal silicon, and achieve shortening Texturing time, improvement of photoelectric conversion efficiency, and improvement of texturing effect
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Embodiment 1
[0029] (1) Additive preparation: use 1L deionized water as solvent, add PEG400 20g, PVP-K12 5g, APG0816 15g, benzoic acid 3g, NaCl and Na 2 SiO 3Each 4g was fully stirred and dissolved; (2) Preparation of texturing solution: 38.0 mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 18.0 mL of additives were added to obtain an alkaline texturing solution; (3) pre- Preparation of cleaning solution: add 15mL of 30% NaOH solution by weight to 1 L of deionized water, KClO 3 1.4mol, fully dissolved; (4) Preparation of mixed acid solution: prepare a mixed acid solution with a total concentration of 1.5 mol / L by mixing HF and HCl at a ratio of 1:2; After cleaning in the pre-cleaning solution for 5 minutes, wash it with deionized water, and then immerse the monocrystalline silicon wafer in the texturing solution. The temperature of the texturing solution is 80 ° C, and the texturing time is 15 minutes; Dip the wafer in deionized water fo...
Embodiment 2
[0031] (1) Additive preparation: use 1L deionized water as solvent, add PEG800 18g, PVP-K15 4g, APG0214 16g, lactic acid 4g, KCl and K 2 SiO 3 Each 3g was fully stirred and dissolved; (2) Preparation of texturing solution: 35.0 mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 20.0 mL of additives were added to obtain an alkaline texturing solution; (3) pre- Preparation of cleaning solution: add 12mL of 30% NaOH solution by weight to 1 L of deionized water, H 2 o 2 1.0mol, fully dissolved; (4) Preparation of mixed acid solution: mix HF and H 2 SO 4 Prepare a mixed acid solution with a concentration of 1.4 mol / L according to a molar ratio of 4:3; (5) Clean the cut monocrystalline silicon wafers in a pre-cleaning solution at 65°C for 5 minutes, then wash them with deionized water, and then Immerse the monocrystalline silicon wafer in the texturing solution, the temperature of the texturing solution is 85°C, and the texturing ...
Embodiment 3
[0033] (1) Additive preparation: use 1L deionized water as solvent, add PEG600 16g, PVP-K17 6g, APG1216 18g, citric acid 7g, NaCl and Na 2 SO 4 2g and 3g were fully stirred and dissolved respectively; (2) Preparation of texturing solution: 38.0 mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 22.0 mL of additives were added to obtain an alkaline texturing solution; ( 3) Preparation of pre-cleaning solution: add 15 mL of 30% NaOH solution by weight to 1 L of deionized water, KCr 2 o 7 1.0mol, fully dissolved; (4) Preparation of mixed acid solution: mix HF and HNO 3 Prepare a mixed acid solution with a concentration of 1.5 mol / L according to a molar ratio of 7:8; (5) Clean the cut monocrystalline silicon wafers in a pre-cleaning solution at 65°C for 5 minutes, then wash them with deionized water, and then Immerse the monocrystalline silicon wafer in the texturing solution, the temperature of the texturing solution is 82°C, a...
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