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Preparation method and application of high-thermal-conductivity material composite filler

A technology of composite fillers and inorganic thermally conductive fillers, which is applied in the field of thermally conductive materials, can solve the problems that the thermally conductive network is easily damaged, affects the thermally conductive effect, does not have high hardness, etc., and achieves strong bonding, improved wear resistance, and improved thermal conductivity. Effect

Inactive Publication Date: 2019-12-27
深圳市锦昊辉实业发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional thermally conductive fillers generally do not have high hardness. During the use of fillers, the thermal conduction network inside the composite material is easily damaged, which affects the thermal conduction effect.

Method used

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  • Preparation method and application of high-thermal-conductivity material composite filler
  • Preparation method and application of high-thermal-conductivity material composite filler

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A high thermal conductivity material composite filler, characterized in that it specifically includes the following ingredients in parts by weight: polyamide resin, graphite, inorganic thermal conductivity filler, wear-resistant ceramic powder, carbon fiber, diamond powder, glass fiber, scaly high thermal conductivity carbon powder, Compatibilizer, curing agent, antioxidant;

[0024] Specifically in this embodiment, the following components are included in parts by weight: 42.5 parts of polyamide resin, 40 parts of graphite, 13 parts of inorganic thermally conductive filler, 12.5 parts of wear-resistant ceramic powder, 6.5 parts of carbon fiber, 6.5 parts of diamond powder, 5.5 parts of glass fiber 5.5 parts of flaky high thermal conductivity carbon powder, 3 parts of compatibilizer, 0.35 parts of curing agent, and 0.35 parts of antioxidant.

[0025] Further, the inorganic thermally conductive filler is one or a combination of aluminum oxide, boron nitride, and aluminum...

Embodiment 2

[0033] A high thermal conductivity material composite filler, characterized in that it specifically includes the following ingredients in parts by weight: polyamide resin, graphite, inorganic thermal conductivity filler, wear-resistant ceramic powder, carbon fiber, diamond powder, glass fiber, scaly high thermal conductivity carbon powder, Compatibilizer, curing agent, antioxidant;

[0034] Specifically in the present embodiment, the following components by weight are included: 35 parts of polyamide resin, 30 parts of graphite, 10 parts of inorganic heat-conducting filler, 10 parts of wear-resistant ceramic powder, 3 parts of carbon fiber, 10 parts of diamond powder, 3 parts of glass fiber 1 part, 3 parts of flaky high thermal conductivity carbon powder, 1 part of compatibilizer, 0.2 part of curing agent, 0.2 part of antioxidant.

[0035] Further, the inorganic thermally conductive filler is one or a combination of aluminum oxide, boron nitride, and aluminum nitride.

[0036]...

Embodiment 3

[0043] A high thermal conductivity material composite filler, characterized in that it specifically includes the following ingredients in parts by weight: polyamide resin, graphite, inorganic thermal conductivity filler, wear-resistant ceramic powder, carbon fiber, diamond powder, glass fiber, scaly high thermal conductivity carbon powder, Compatibilizer, curing agent, antioxidant;

[0044] And be specific in the present embodiment, comprise following composition by weight: 60 parts of polyamide resins, 50 parts of graphite, 16 parts of inorganic heat-conducting fillers, 15 parts of wear-resistant ceramic powders, 10 parts of carbon fibers, 10 parts of diamond powders, 8 parts of glass fibers 8 parts, 8 parts of flaky high thermal conductivity carbon powder, 5 parts of compatibilizer, 0.5 part of curing agent, 0.5 part of antioxidant.

[0045] Further, the inorganic thermally conductive filler is one or a combination of aluminum oxide, boron nitride, and aluminum nitride.

[...

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Abstract

The invention discloses a preparation method and application of high-thermal-conductivity material composite filler. The invention relates to the technical field of heat-conducting materials. The composition comprises the following components in parts by weight, 35-60 parts of polyamide resin, 30-50 parts of graphite, 10-16 parts of an inorganic heat-conducting filler, 10-15 parts of wear-resistant ceramic powder, 3-10 parts of carbon fibers, 3-10 parts of diamond powder, 3-8 parts of glass fibers, 3-8 parts of flaky high-heat-conducting carbon powder, 1-5 parts of a compatibilizer, 0.2-0.5 part of a curing agent and 0.2-0.5 part of an antioxidant. The wear-resistant ceramic powder is added, so that the average hardness of the filler is improved through the silicon nitride, the aluminum oxide, the silicon carbide and the silicon oxide; therefore, the wear resistance of the filler is improved compared with existing filler, a heat conduction network formed in the filler is prevented frombeing damaged, and meanwhile electronic elements in the filler are protected.

Description

technical field [0001] The present invention relates to the technical field of heat-conducting materials, more specifically, the present invention relates to a preparation method and application thereof of high heat-conducting material composite fillers. Background technique [0002] With the rapid development of miniaturization and multi-functionalization of electronic components, the assembly density of components is getting higher and higher, and the unit calorific value is rising rapidly. The electronics industry urgently needs materials with high thermal conductivity and low dielectric constant. As the name implies, thermally conductive fillers are fillers added to the matrix material to increase the thermal conductivity of the material. Commonly used thermally conductive fillers include alumina, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, etc.; among them, micron-sized Alumina and silicon micropowder are the main body, and nano-alumin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08K13/04C08K3/04C08K7/06C08K7/14C08K7/00C08K3/34C08K3/22C08K3/36C08K3/38C08K3/28C09K5/14
CPCC08K3/04C08K3/22C08K3/28C08K3/34C08K3/36C08K3/38C08K7/00C08K7/06C08K7/14C08K13/04C08K2003/2227C08K2003/282C08K2003/385C09K5/14C08L77/00
Inventor 邓娇容甘祖荣常红丽
Owner 深圳市锦昊辉实业发展有限公司
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