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A kind of preparation method of ultra-low dielectric constant glass microsphere/resin composite material

A resin composite material and ultra-low dielectric constant technology, applied in the field of material science, can solve the problems of high dielectric constant and unstable performance, and achieve the effect of improving performance stability

Active Publication Date: 2021-09-21
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problem of high dielectric constant and unstable performance of dielectric substrate materials in the prior art, and to provide an ultra-low dielectric constant glass bead / resin composite material and its method

Method used

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  • A kind of preparation method of ultra-low dielectric constant glass microsphere/resin composite material
  • A kind of preparation method of ultra-low dielectric constant glass microsphere/resin composite material
  • A kind of preparation method of ultra-low dielectric constant glass microsphere/resin composite material

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Effect test

Embodiment 1

[0023] In the preparation method provided in this embodiment, the dielectric constant of the glass microsphere / resin composite material is 1.85 to 2.93, and the specific steps are as follows:

[0024] Step 1. Add 0.2-0.4wt% thickener polyacrylamide (PAM), 8-12wt% monomer acrylamide (AM) and 0.8-1.2wt% cross-linking agent N-N' to deionized water - Methylenebisacrylamide (MBAM), configured as a solvent for water-based slurry;

[0025] Step 2, adding glass microspheres into the above solvent, wherein the volume fraction of glass microspheres in the slurry is 15-55vol%, and stirring for 1-2 hours;

[0026] Step 3, add initiator ammonium persulfate (APS) and catalyst tetramethylethylenediamine (TEMED) in slurry, the mass ratio of initiator and monomer is 1:(3~10), the ratio of catalyst to monomer The mass ratio is 1:(30-200), continue to stir for 2 minutes; vacuum defoam the slurry, and pour it into the mold for cross-linking and solidification;

[0027] Step 4: Submerge the soli...

Embodiment 2

[0033] In the preparation method provided in this example, the dielectric constant of the glass microsphere / resin composite material is 2.93, and the specific steps are as follows:

[0034] Step 1. Add 0.4wt% thickener polyacrylamide (PAM), 12wt% monomeric acrylamide (AM) and 1.2wt% crosslinker N-N'-methylenebispropylene to deionized water Amide (MBAM), configured as a solvent for water-based slurry;

[0035] Step 2, glass microspheres are added in the above-mentioned solvent, wherein the volume fraction of glass microspheres in the slurry is 15vol%, stir for 2 hours, then add initiator and catalyst, wherein the initiator is ammonium persulfate (APS), initiate The mass ratio of agent and monomer is 1:5, and catalyzer is tetramethylethylenediamine (TEMED), and the mass ratio of catalyzer and monomer is 1:100, continues to stir 2 minutes;

[0036] Step 3. Vacuum defoam the above slurry, inject it into the mold for cross-linking and solidification; submerge the solidified blank ...

Embodiment 3

[0043] The difference between this embodiment and embodiment 2 is that the resin monomer in step five is BT monomer, and the others are the same as in embodiment 2. The prepared ceramics have a dielectric constant of 2.91 and a dielectric loss of 4.87×10 -3 .

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Abstract

The invention relates to a method for preparing an ultra-low dielectric constant glass bead / resin composite material, comprising the following steps: step (1) putting a powdery resin monomer into a mold, and placing a glass bead skeleton above it; step (2) ) Put the mold into a vacuum drying oven, evacuate to below 10Pa, and heat to 100-130°C to melt the resin monomer and penetrate into the openings of the glass bead skeleton under the action of capillary force. The invention obtains the dispersion and stable glass bead slurry by adding a thickener to the glass bead slurry, and then prepares the glass bead skeleton through gel injection molding and sintering. At the same time, the method of vacuum assisted impregnation is used to impregnate the resin monomer into the porous framework to prevent the delamination of the glass beads, improve the stability, and obtain the glass beads / resin composite material with ultra-low dielectric constant.

Description

technical field [0001] The invention relates to the technical field of material science, in particular to an ultra-low dielectric constant glass bead / resin composite material for a high-speed substrate and a method thereof. Background technique [0002] With the advancement of communication technology, high speed and high frequency have become an important trend in the development of electronic products and communication products. Information and communication technologies represented by mobile communication, satellite communication and Bluetooth technology continue to pursue multi-channel, high-performance and multi-functionalization, which makes the frequency of communication signals continue to increase, and the performance of the printed circuit board (PCB) as a carrier has become The main factors affecting the characteristics of digital circuits. The propagation speed of electromagnetic signals is closely related to the dielectric constant of the medium. The higher the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/56C08F222/38C08F2/44C08K7/20C08L33/26
CPCC08F2/44C08F220/56C08L33/26C08L2205/025C08F222/385C08K7/20
Inventor 叶枫张标丁俊杰叶健高晔
Owner HARBIN INST OF TECH
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