Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for high-depth-diameter-ratio micro-hole high-speed electrosparking

A depth-to-diameter ratio and electric spark technology, applied in the field of machining and tools, can solve the problems of fast wear of the rotating spindle, electrochemical corrosion of the spindle, and small impact force of the abrasive jet, so as to reduce the wear rate, improve stability, and improve The effect of pressure

Pending Publication Date: 2019-12-13
DALIAN UNIV OF TECH
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to design a new type of high-speed EDM device for micro-holes with a large depth-to-diameter ratio to solve the problems of fast wear of the rotating spindle, severe electrochemical corrosion of the spindle and small impact force of abrasive jets

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for high-depth-diameter-ratio micro-hole high-speed electrosparking
  • Device for high-depth-diameter-ratio micro-hole high-speed electrosparking

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings and technical solutions.

[0017]The invention relates to a high-speed electric spark microhole processing device with a large depth-to-diameter ratio. The equipment used is an XYZ three-axis machine tool, a rotating spindle and a working fluid pipeline. EDM machine tool includes: upper computer 1, A / D converter 2, marble base 3, Y movement spindle 4, X movement spindle 5, liftable support table 6, workpiece clamping platform 7, guide support frame 8, guide Device 9, Z motion spindle 10, spindle support frame 11, pulse power supply 20, discharge state detector 21.

[0018] The rotating spindle includes: servo motor 12, tube electrode 13-1, conductive nut 13-2, electrode chuck 13-3, power supply carbon brush 13-4, electrode sealing water stopper 13-5, locking nut 13- 6. Carbon brush holder 13-7, adjustable lower cover plate 13-8, gra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a device for high-depth-diameter-ratio micro-hole high-speed electrosparking, and belongs to the field of machining and tools. Through the innovative design of a rotating spindle structure, ceramic and polytetrafluoroethylene materials are ingeniously applied, the problems of serious internal electrochemical corrosion of a spindle, high abrasion rate of a sealing piece and difficult replacement are solved, the rotating precision of the spindle is improved, and the service life of the spindle is prolonged.

Description

technical field [0001] The invention relates to a method and device for high-speed electrical discharge machining of microholes with a large depth-to-diameter ratio, and belongs to the field of mechanical processing and tools. Background technique [0002] Micropores with large aspect ratio are more and more widely used in automobiles, biomedicine, nuclear industry, aviation, aerospace and other fields. When machining holes with traditional machining methods, the cutting environment of the tool is poor, and there are problems such as low rigidity of the tool holder, difficulty in cooling, and difficulty in chip removal. In micro hole processing, when the hole diameter is less than 1mm, traditional machining can hardly be completed. Micro-EDM is non-contact processing. During the processing, the tool electrode does not touch the workpiece, the tool electrode will not be deformed by force, and the micro-EDM is almost not affected by the strength and hardness of the workpiece....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23H1/00B23H9/14
CPCB23H1/00B23H9/14
Inventor 余祖元陈烨佟宇赵智
Owner DALIAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com