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Protective film

A technology of protective film and adhesive layer, applied in the direction of film/sheet adhesive, adhesive type, other rubber adhesives, etc., can solve the problem that the haze of the protective film is not low enough, can not suppress debris, Achieves excellent laser processability, suppresses generation of chips, and excellent inspection performance by eliminating problems such as reduced inspection performance

Pending Publication Date: 2019-12-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to irradiate the object to be processed with ultraviolet rays, and there is a problem that it is difficult to apply this method to an object to be processed that is not resistant to ultraviolet radiation (for example, there are many optical members such as polarizers).
In addition, since the haze of the protective film used in this method is not low enough, problems such as a decrease in inspection performance in the manufacturing process still occur.
Furthermore, the generation of debris itself cannot be suppressed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0252] The adhesive composition (1) obtained in Production Example 2 was applied to the laminate (A) of [substrate layer] / [antistatic layer] obtained in Production Example 4 so that the dried thickness became 75 μm The non-antistatic treated surface was cured and dried at a drying temperature of 130°C and a drying time of 3 minutes. In this way, the adhesive layer (1) formed from the adhesive composition (1) was produced on the base material layer.

[0253] Next, a separator made of a polyester resin with a thickness of 25 μm (trade name “MRF25”, thickness 25 μm, manufactured by Mitsubishi Chemical Corporation) was attached to the surface of the obtained adhesive layer (1). Silicone-treated surface, obtained a protective film (1).

[0254] The obtained protective film (1) was aged at room temperature for 7 days and evaluated. The peeling sheet was peeled off immediately before evaluation. The results are shown in Table 1.

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Abstract

The present invention addresses the problem of providing a protective film which has excellent laser processability, suppresses the occurrence and adhesion of condensation deposits, and has excellentinspectability in a manufacturing process. The protective film according to the present invention has an adhesive layer and an antistatic layer, the adhesive layer being formed from an adhesive composition containing a base polymer and metal oxide particles having an average primary particle diameter of 1-200 nm.

Description

technical field [0001] The present invention relates to protective films. Background technique [0002] Laser dicing, in which processing is performed by irradiating laser light, is used for the division of semiconductor chips, etc., optical components, electronic components, etc. manufactured by dicing and division of semiconductor wafers. [0003] However, if laser cutting is performed, since the laser irradiation point becomes extremely high temperature, the material of the object to be processed is vaporized, etc., and debris (condensation) is generated, and the debris adheres to the surface of the object to be processed. If such debris adheres to the object to be processed, problems such as degradation of the quality of the manufactured product, contamination of the production line, and degradation of inspection performance in the manufacturing process arise. [0004] In order to solve the above-mentioned problems, the following method has been proposed: forming a prot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J175/04C09J11/04C08J7/04C09D167/00C09D165/00C09D125/18C09D5/24C08L67/00
CPCC09J7/255C09J175/04C09J11/04C09D167/00C09D5/24C08J2367/00C08J2467/00C08J2465/00C08J2425/18C09J2467/006C09J2475/00C09J2301/122C09J2301/408C08L65/00C08L25/18C08K3/36C09J7/30C09J133/00C09J121/00C09J183/04C08K2201/005C09J2301/312
Inventor 越智元气高桥智一
Owner NITTO DENKO CORP
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